Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series

Lineup of environment-friendly materials corresponding to the various application of mobile products.

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General properties

Item Test method Condition Unit Halogen-free
R-A555(W)
Halogen-free
R-1533
Halogen-free
R-1566
Glass transition temp (Tg) DMA A °C 200 170 170
Thermal decomposition temp (Td) TG/DTA A °C 380 385 350
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13 11-13 11-13
CTE y-axis 13-15 13-15 13-15
CTE z-axis α1 IPC TM-650 2.4.24 35 35 40
α2 170 200 180
T288 (with copper) IPC TM-650 2.4.24.1 A min >60 >120 3
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 3.45* 4.6 4.6
Dissipation factor (Df) 0.008* 0.013 0.010
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.07 0.12 0.14
Flexural modulus Warp/MD JIS C6481 A GPa 25 24 24
Fill/TD 23 22 22

The sample thickness is 0.8mm.
* Resin content 70wt%

The above data are typical values and not guaranteed values.