Semiconductor Device Materials

Product List

  • IC Substrate Materials "LEXCM GX" series
  • Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
  • Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
  • Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series

通知

[ 2023 ]

  • Oct
    18
    Information
    Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
  • Mar
    16
    Information
    Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments

[ 2021 ]

  • Jun
    22
    New product
    Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
  • Mar
    2
    New product
    Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement

[ 2018 ]

  • Dec
    13
    To Bolster Substrate Material Business in North East Asian Region
News list