Against the backdrop of the rapid digitization of vehicles, Panasonic provides devices best suited to customer's needs.
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In-Vehicle Server for Autonomous Driving
Tire Pressure Monitoring System (TPMS)
Detailed information about the automotive applications of relays, connectors, and switches is provided below.
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Point the mouse cursor to the product that you are interested in and click the product name to see the product details.
Capacitors
- Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- Aluminum Electrolytic Capacitors (Surface Mount Type)
- Film Capacitors (Electronic Equipment Use)
- Film Capacitors (Automotive, Industrial and Infrastructure Use)
Resistors
- High Temperature Chip Resistors
- High Precision Chip Resistors
- Current Sensing Chip Resistors
- Small & High Power Chip Resistors
- Anti-Sulfurated Chip Resistors
Inductors
Thermal Management Solutions
- Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
- NTC Thermistor (Chip type)
- Cooling Fan with Unique Hydro Dynamic Bearing
EMC Components
Circuit Protection
Sensors
Input Devices
Relays
Connectors
- Automotive Connector
- FPC/FFC Connector(Y5B/Y5BW)
- Narrow Pitch Connector for board to board(P4S)
- Narrow Pitch Connector for board to board(P5K/P5KS)
Batteries (for Business)
Electronic Materials
- Ultra-low transmission loss, highly heat-resistant multi-layer circuit board materials MEGTRON8
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7
- Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON6
- Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials XPEDION1
- Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type> HIPER D
- Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M
- Highly heat resistant Low CTE Multi-layer circuit board materials HIPER E
- High thermal conductivity Glass composite circuit board materials ECOOL
- Flexible circuit board materials FELIOS
- Flexible circuit board materials LCP(Liquid Crystal Polymer) FELIOS LCP
- Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
- Mass laminations(Shield board) "PreMulti"
- High reliability Glass composite Circuit board materials
- High heat resistance Secondary mounting Sidefill materials
- High heat resistance Secondary mounting Underfill materials
- Low-temperature curing Secondary mounting Underfill materials
- For secondary mounting reinforcement drop impact resistance liquid encapsulant
- For power modules high thermal conductive semiconductor encapsulation materials
- For high heat resistance power devices semiconductor encapsulation materials
- For LED (optical parts) light diffusion/reflection PP molding compounds FULL BRIGHT PP
- High heat resistance Phenolic Molding Compound for Automotive Components
- Long-term reliable PBT Molding Compound for Automotive Components
- Anti-Glare Type Anti-Reflection Films
- Clear Type Anti-Reflection Films
- Moldable Low-Reflection Films
- Anti-Rainbow and Anti-Blackout Films
- Thermal Insulation Optical Films