Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON M | R-5735

Low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON M R-5735

 

  1. Suitable for high-speed large-volume data transmission of server and router at High-end/Volume zone.

Circuit Board Materials

  • Part Number

Laminate R-5735
Prepreg R-5630

  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna, Etc.

Electronic Materials

Properties

Dk 3.75 Df 0.0087
@13GHz
Tg(DSC)
195°C
T288(with copper)
35min

Video

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layer

Heat resistance of High Multi-layer

Solder heat resistance(float)

Solder heat resistance(float)

IST(Interconnect Stress Test)

IST(Interconnect Stress Test)

General properties

Item Test method Condition Unit   MEGTRON M  
R-5735
Glass transition temp.(Tg) DSC A °C 195
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 31
α2 240
T288(with copper) IPC-TM-650 2.4.24.1 A min 35
Dielectric constant(Dk) 13GHz Balanced-type circular
disk resonator method		 C-24/23/50 － 3.75
Dissipation factor(Df) 0.0087
Peel strength 1oz(35μm) IPC-TM-650 2.4.8 A kN/m 1.3 [ST]

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.

Related information

[ Product summary ]

[ Data Sheet ]

  • *    Revised due to changes in high-frequency measuring equipment
    **   Former version, Before April 2022

[ Process Guideline ]

  • Please contact your Panasonic Industry sales.

[ Product Information Sheet ]

[ Related products ]

[ Common information ]