IC Substrate Materials "LEXCM GX" series

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Contribute to IC substrates as thinner and smaller and low warpage.

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LEXCM GX Line-up

General properties

Item  Test method Condition Unit R-1515V R-1515K R-G535S R-G535E
Glass transition temp(Tg) DMA*2 A °C 260 260 260 260
CTE x-axis α1 Internal method A ppm/°C 3-5 7 4-6 7-8
CTE y-axis 3-5 7 4-6 7-8
Dielectric constant(Dk)*1 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.4 4.6 4.4 4.6
Dissipation factor(Df)*1 0.016 0.015 0.015 0.015
Flexural modulus*1 JIS C 6481 25°C GPa 30 27 32-34 28-30
250°C 14 12 20-22 18-20
Peel strength 1/3oz IPC-TM-650 2.4.8 A kN/m 0.6 0.6 0.7 0.7
Thickness line-up mm 0.20-1.8 0.20-1.8 0.20-1.8 0.20-1.8
Item  Test method Condition Unit R-1515W R-1515A R-G545L R-G545E
Glass transition temp(Tg) DMA*2 A °C 250 205 230 230
CTE x-axis α1 Internal method A ppm/°C 9 12 10 10
CTE y-axis 9 12 10 10
Dielectric constant(Dk)*1 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.8 4.8 3.6 4.1
Dissipation factor(Df)*1 0.015 0.015 0.002 0.002
Flexural modulus*1 JIS C 6481 25°C GPa 35 27 23 27
250°C 21 10 10 13
Peel strength 1/3oz IPC-TM-650 2.4.8 A kN/m 0.9 0.9 0.6 0.6
Thickness line-up mm 0.20-0.8 0.10-0.8 0.04-0.2 0.04-0.2
Item  Test method Condition Unit R-G515S R-G515E R-1515E
Glass transition temp(Tg) DMA*2 A °C 220-240 220-240 270
CTE x-axis α1 Internal method A ppm/°C 4-6 6-8 9
CTE y-axis 4-6 6-8 9
Dielectric constant(Dk)*1 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.2 4.4 4.7
Dissipation factor(Df)*1 0.008 0.008 0.011
Flexural modulus*1 JIS C 6481 25°C GPa 28 24 33
250°C 18
Peel strength 1/3oz IPC-TM-650 2.4.8 A kN/m 0.7 0.7 0.9
Thickness line-up mm 0.03-0.1 0.03-0.1 0.04-0.2

The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode. R-1515W, R-1515A: Measurement in bending mode.

The above data are typical values and not guaranteed values.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

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