![For high heat resistance power devices semiconductor encapsulation materials](/content/data/EM/pictures/olimg_ecomsic.jpg)
- By adopting a new epoxy system, this material has excellent heat resistance and can be applied to the next generation power devices (SiC, GaN).
- Contribute to improving power module performance and reliability under high temperature environment.
Semiconductor Encapsulation Materials
- Part Number
![LEXCM CF](/content/data/EM/pictures/logo_lexcm_cf.gif)
CV8540 series
- Application
- Detailed use
![Package](/content/data/EM/pictures/pict_sem_pkg.gif)
![Automotive](/content/data/EM/pictures/pict_sem_aut.gif)
・Package
・Automotive
・Automotive
Power devices used in industry/Automotive inverters
Properties
High heat resistance
Low warpage, Low stress
High insulation
EMC (Epoxy Molding Compound) explainer video
Concept
![Concept](/content/data/EM/pictures/ww_img_ecomsic_01.jpg)
High heat resistance
![High heat resistance](/content/data/EM/pictures/ww_img_ecomsic_02.jpg)
Dielectric property (Tg dependence)
![Dielectric property (Tg dependence)](/content/data/EM/pictures/ww_img_ecomsic_03.jpg)
General properties
Item | Unit | LXCEM CF CV8540 series |
Glass transition temp. Tg (TMA) | °C | 185-205 |
CTE 1 | ppm/°C | 11-13 |
CTE 2 | 48 | |
Flexural strength (25°C) | MPa | 130-160 |
Flexural modulus (25°C) | GPa | 15-19 |
Flammability (UL-94) | – | V-0 |
Mold shrinkage | % | 0.25-0.4 |
Gelation time | sec | 30-40 |
The above data are typical values and not guaranteed values.