Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min
Solder heat resistance:JIS C6481,260°C solder float for 2min
Heat resistance,1oz:JIS C6481
CTE:α1,X-axis,IPC-TM-650 2.4.41,TMA
CTE:α1,Y-axis,IPC-TM-650 2.4.41,TMA
CTE:α1,Z-axis,IPC-TM-650 2.4.24,TMA
Dielectric constant
(Dk):1MHz,IPC-TM-650 2.2.2.9,C-24/23/50
Dielectric constant
(Dk):1GHz,IPC-TM-650 2.2.2.9,C-24/23/50
Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65
Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65+D-24/23
Dielectric constant (Dk):1GHz,IPC TM-650 2.5.5.9,C-24/23/50
Dissipation factor (Df):1MHz,IPC TM-650 2.5.5.9,C-24/23/50
Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df):1MHz,JIS C6481,C-96/20/65
Dissipation factor (Df):1MHz,JIS C6481,C-96/20/65+D-24/23
Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50
Volume resistivity:JIS C6481,C-96/20/65
Volume resistivity:JIS C6481,C-96/20/65+C-96/40/90
Surface resistivity:JIS C6481,C-96/20/65
Surface resistivity:JIS C6481,C-96/20/65+C-96/40/90
Insulation resistance:JIS C6481,C-96/20/65
Insulation resistance:JIS C6481,C-96/20/65+D-2/100
Water absorption:JIS C6481,E-24/50+D-24/23
Flexural strength:Fill,JIS C6481
Peel strength:JIS C6481,Copper foil0.018mm(18µm),A
Peel strength:JIS C6481,Copper foil0.018mm(18µm),S₄
Peel strength:JIS C6481,Copper foil0.035mm(35µm),A
Peel strength:JIS C6481,Copper foil0.035mm(35µm),S₄
Peel strength:2oz,JIS C6481,A
Peel strength:2oz,JIS C6481,260°C solder float for 20sec
Alkali resistance:JIS C6481,dipping (3min)
Flammability:JIS C6481,A+E-168/70
Tracking resistance:IEC 60112
Accuracy of thickness (σ value)