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Glass Composite Circuit Board Materials : Models

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Datasheet		 Series/Type Glass transition temp.(Tg) :TMA,Temp. rising rate: 10°C/min
(°C) 		Solder heat resistance:JIS C6481,260°C solder float for 2min Heat resistance,1oz:JIS C6481 CTE:α1,X-axis,IPC-TM-650 2.4.41,TMA
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.41,TMA
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24,TMA
(ppm/°C)		 Dielectric constant
(Dk):1MHz,IPC-TM-650 2.2.2.9,C-24/23/50 		Dielectric constant
(Dk):1GHz,IPC-TM-650 2.2.2.9,C-24/23/50 		Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65 		Dielectric constant
(Dk):1MHz,JIS C6481,C-96/20/65+D-24/23 		Dielectric constant (Dk):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 Dissipation factor (Df):1MHz,IPC TM-650 2.5.5.9,C-24/23/50 Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 Dissipation factor(Df):1MHz,JIS C6481,C-96/20/65 Dissipation factor (Df):1MHz,JIS C6481,C-96/20/65+D-24/23 Dissipation factor (Df):1GHz,IPC TM-650 2.5.5.9,C-24/23/50 Volume resistivity:JIS C6481,C-96/20/65
(MΩ·m)		 Volume resistivity:JIS C6481,C-96/20/65+C-96/40/90
(MΩ·m)		 Surface resistivity:JIS C6481,C-96/20/65
(MΩ)		 Surface resistivity:JIS C6481,C-96/20/65+C-96/40/90
(MΩ)		 Insulation resistance:JIS C6481,C-96/20/65
(MΩ)		 Insulation resistance:JIS C6481,C-96/20/65+D-2/100
(MΩ)		 Water absorption:JIS C6481,E-24/50+D-24/23
(%)		 Flexural strength:Fill,JIS C6481
(N/mm²)		 Peel strength:JIS C6481,Copper foil0.018mm(18µm),A
(N/mm)		 Peel strength:JIS C6481,Copper foil0.018mm(18µm),S₄
(N/mm)		 Peel strength:JIS C6481,Copper foil0.035mm(35µm),A
(N/mm)		 Peel strength:JIS C6481,Copper foil0.035mm(35µm),S₄
(N/mm)		 Peel strength:2oz,JIS C6481,A
(kN/m)		 Peel strength:2oz,JIS C6481,260°C solder float for 20sec
(kN/m)		 Alkali resistance:JIS C6481,dipping (3min) Flammability:JIS C6481,A+E-168/70 Tracking resistance:IEC 60112
(V)		 Accuracy of thickness (σ value)
(mm)
R-1785
 High reliability Glass composite Circuit board materials 150 No abnormality - 19 (15) 21 (17) 50 4.2 4 - - - 0.023 0.01 - - - - - - - 5x10^8 - - - - - - - - - - - CTI≧600 0.013
R-1786
 Thick copper glass composite circuit board materials 140 No abnormality 240°C 60min 25 (20) 28 (23) 65 - - 4.2 4.2 4 - - 0.011 0.011 0.007 1x10^8 5x10^7 3x10^8 1x10^8 5x10^8 1x10^7 0.08 280 - - - - 2.2 2.1 No abnormality 94V-0 - -
R-1786/R-1781
 Double-sided copper clad
Single-sided copper clad		 140 No abnormality 240°C 60min 25 (20) 28 (23) 65 - - 4.2 4.2 4 - - 0.011 0.011 0.007 1x10^8 5x10^7 3x10^8 1x10^8 5x10^8 1x10^7 0.08 280 1.37 1.37 1.76 1.76 - - No abnormality 94V-0 - -
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