Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7

Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7 R-578Y(N), R-578Y(GN), R-578Y(GE), R-578Y(R), R-5785(N), R-5785(GN), R-5785(GE), R-5785(R)

 

  1. Due to our industry leading low dielectric constant and dissipation factor, these materials are suitable for high-speed data transmission by servers and routers using high-layercount, large-size PCB designs.

Circuit Board Materials

  • Part Number
  • Application
  • Detailed use
Network
Aerospace
・Network
・Wireless
・Aerospace
ICT infrastructure equipment, Supercomputer, Measuring instrument, Antenna(Base station, Automotive millimeter-wave radar), Aerospace, etc.

New part number

Low Dk glass cloth

Laminate R-578Y(N)

Prepreg R-568Y(N)

Low Dk glass cloth
Improved processability

Laminate R-578Y(GN)

Prepreg R-568Y(GN)

Normal glass cloth
Improved processability

Laminate R-578Y(GE)

Prepreg R-568Y(GE)

Buried Resistor Copper Foil

Laminate R-578Y(R)

Existing part number

Low Dk glass cloth

Laminate R-5785(N)

Prepreg R-5680(N)

Low Dk glass cloth
Improved processability

Laminate R-5785(GN)

Prepreg R-5680(GN)

Normal glass cloth
Improved processability

Laminate R-5785(GE)

Prepreg R-5680(GE)

Buried Resistor Copper Foil

Laminate R-5785(R)

  • There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
suffix

Properties

Dk 3.31 Df 0.0023
@14GHz
Tg(DSC)
200°C
T288(with copper)
>120min

Video

Transmission loss performance Ranking in MEGTRON series

Transmission loss performance Ranking in MEGTRON series

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Heat resistance of High Multi-layered

Heat resistance of High Multi-layered

Buried Resistor Copper Foil specification

Buried Resistor Copper Foil specification

General properties

Item Test method Condition Unit MEGTRON7
R-578Y(N)
R-5785(N)
Low Dk
glass cloth
MEGTRON7
R-578Y(GN)
R-5785(GN)
Low Dk
glass cloth
MEGTRON7
R-578Y(GE)
R-5785(GE)
Normal
glass cloth
Glass transition temp.(Tg) DSC A °C 200 200 200
CTE z-axis α1 IPC-TM-650
2.4.24
A ppm/°C 42 42 42
α2 280 280 280
T288(with copper) IPC-TM-650
2.4.24.1
A >120 >120 >120
Dielectric constant(Dk) 13GHz
14GHz
Balanced-type
circular disk
resonator
C-24/23/50 3.31 [14GHz] 3.31 [14GHz] 3.60 [13GHz]
Dissipation factor(Df) 0.0023 [14GHz] 0.0023 [14GHz] 0.0034 [13GHz]
Peel strength* 1oz(35μm) IPC-TM-650
2.4.8
A kN/m 0.8 0.8 0.8

The sample thickness is 0.75mm.
* R-578Y(GN), R-5785(GN), R-578Y(GE), R-5785(GE): H-VLP2 Copper, R-578Y(N), R-5785(N): H-VLP Copper

The above data are typical values and not guaranteed values.

Related information