- Leveraging multi-layer processability, low transmission loss, high thermal conductivity and Halogen-free, these materials are suitable for miniaturized and 5G small cell PCBs.
Circuit Board Materials
- Part Number
- Application
- Detailed use
・Wireless
・Automotive
・Automotive
Power amplifier board (Base station for wireless communication, Small cell), Antenna (Automotive millimeter-wave radar, Base station), etc.
New part number
Laminate R-5575X
Prepreg R-5470X
Existing part number
Laminate R-5575
Prepreg R-5470
- There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
Properties
Dk 3.60 Df 0.0045
@13GHz
@13GHz
Thermal conductivity
0.60W/m·K
0.60W/m·K
Tg (DMA)
245°C
245°C
Video
Frequency dependence by Transmission loss
Long-term stability under High temperature(Dk, Df)
General properties
Item | Test method | Condition | Unit | XPEDION T1 R-5575X R-5575 |
Other company | |
---|---|---|---|---|---|---|
Glass transition temp.(Tg) | TMA | A | °C | 205 | Tg less | |
DMA | 245 | Tg less | ||||
CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 20 | 21 |
α2 | 155 | 42 | ||||
T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
Thermal conductivity | Laser flash | A | W/m·K | 0.6 | 0.6 | |
Dielectric constant(Dk) | 13GHz | Balanced-type circular disk resonator method |
C-24/23/50 | - | 3.60 | 3.5 |
Dissipation factor(Df) | 0.0045 | 0.004 | ||||
Peel strength* | 1oz(35µm) | IPC-TM-650 2.4.8 | A | kN/m | 0.80 | 0.58 |
The sample thickness is 0.5mm
* RT Copper
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.