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카테고리를 선택해 주시기 바랍니다

선택해주시기 바랍니다 콘덴서(캐패시터) 전도성 고분자 콘덴서 Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap) Conductive Polymer Tantalum Solid Capacitors (POSCAP) Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors 알루미늄 전해 콘덴서 Conductive Polymer Aluminum Solid Capacitors (OS-CON) Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Aluminum Electrolytic Capacitors (Surface Mount Type) Aluminum Electrolytic Capacitors (Radial Lead Type) 전기 2중층 콘덴서(골드 캐퍼시터) Backup Power Supply Modules with Electric Double Layer Capacitors Electric Double Layer Capacitors (Multilayer Coin Type) (단종제품) Electric Double Layer Capacitors (Wound Type) (단종제품) 필름 콘덴서 Film Capacitors (Electronic Equipment Use) Film Capacitors (AC Motor Use) Film Capacitors (Automotive, Industrial and Infrastructure Use) 저항 칩저항기 High Temperature Chip Resistors High Precision Chip Resistors Current Sensing Chip Resistors Small & High Power Chip Resistors Anti-Sulfurated Chip Resistors General Purpose Chip Resistors Resistor Network 그 외 저항기 Attenuator Chip Ring (check terminal) Leaded Resistors (단종제품) Thermal Sensitive Resistors (단종제품) Trimmer Potentiometers (단종제품) 인덕터(코일) Power Inductors for Automotive application Power Inductors for Consumer Voltage Step-up Coils (단종제품) Multilayer type Power Inductors (단종제품) Choke Coils (단종제품) Chip Inductors (단종제품) 열대책 Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM) NTC Thermistor (Chip type) Cooling Fan with Unique Hydro Dynamic Bearing 전자회로기판재료 Circuit Board Materials for LED lightings "ECOOL" series EMC대책부품・ 회로보호부품 EMC대책부품 Common mode Noise Filters EMI Filters (단종제품) 회로보호부품 ESD Suppressor Chip Varistor Varistors (ZNR Surge Absorber) Fuses 센서 일반 센서 MR Sensor 6DoF Inertial Sensor for Automotive (6in1 Sensor) Gyro Sensors Temperature Sensors (Automotive use) 기기용 센서 Infrared Array Sensor Grid-EYE PS-A Pressure Sensors (built-in amplification and temperature compensating circuit) PS Pressure Sensors PF Pressure Sensors 공기질 센서 PIR Motion Sensor PaPIRs MA Motion Sensor (단종제품) 1-axis accelerometer GF1 (단종제품) Light Sensor NaPiCa (단종제품) GS2 Acceleration Sensor (단종제품) GS1 Acceleration Sensor (단종제품) FA용 센서 입력 디바이스・스위치 스위치 Detector Switches Push Switches Tactile Switches (Light Touch Switches) Power Rocker Switches(Not applicable) Seal Type Switches(Not applicable) Non Seal Type Switches(Not applicable) Limit Switches(Not applicable) Snap Switches(Not applicable) Fall Detection Switches(Not applicable) 감압 스위치 Force Sensing Capacitive Device(Not applicable) 엔코더, 볼륨 Encoders Rotary Potentiometers Position Sensors Touch Panels 릴레이・커넥터 릴레이・커플러 PhotoMOS Power Relays (Over 2A) Safety Relays Solid State Relays (SSR) Signal Relays (2A or less) Microwave Devices (Microwave Relays/Coaxial Switches) Automotive Relays High-capacity DC Cutoff Relays PhotoIC Coupler(Not applicable) Interface Terminal 커넥터 Narrow Pitch Connector for board to FPC Narrow Pitch Connector for board to board High Current Connectors FPC/FFC Connectors Active Optical Connectors FA센서・시스템, 레이저 마킹기 FA용 센서 화이버 센서 라이트 커튼ᆞ안전 기기 에어리어 센서 빔 센서（광전 센서）ᆞ레이저 센서 마이크로 포토 센서 근접 센서 압력ᆞ유량 센서 검사ᆞ판별ᆞ측정용 센서(변위 센서) 특수 용도 센서 센서 주변 기기 배선 절감 시스템 FA 디바이스, 레이저 마킹기 정전기 대책 기기 에너지 절감 지원 기기 PLCᆞ터미널 표시기 화상 처리기 UV 조사기(자외선 경화 장치) 레이저 마킹기・2차원 코드 리더 모터, 컴프레서 FA・일반 산업용 모터 AC 서보 모터・앰프 산업용 브러시리스 모터・앰프 소형 기어드 모터 가전용・전장용 모터 Motors for Air Conditioning Motors for Vacuum Cleaner Motors for Refrigerator Motors for Automotive 컴프레서 Reciprocating Compressors (Variable Speed) Rotary Compressors (Fixed Speed) Rotary Compressors (Variable Speed) Scroll Compressors (Variable Speed) DC Pumps 커스텀・모듈 광부품 Aspherical Glass Lenses FA・용접기 FA Electronic Component Mounting-related Systems Device-related Systems Display-related Systems 용접기, 로봇 시스템 아크 용접기 로봇 시스템 Laser Processing FA 디바이스 Batteries (for Business) Rechargeable Batteries Lithium ion Batteries Nickel-Metal Hydride Batteries Coin type Rechargeable Lithium Batteries Primary Batteries Primary Lithium Batteries 전자재료 전자회로기판재료 High frequency circuit board materials for wireless/RF applications "XPEDION"series Glass Epoxy Circuit Board Materials Semiconductor Device Materials Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series 플라스틱 성형재료 Plastic Molding Compound for LED "FULL BRIGHT" series High heat resistance Phenolic Molding Compound for Automotive Components Long-term reliable PBT Molding Compound Urea molding compounds Melamine molding compounds 기능 필름 Functional films for HUD cover Moldable Low-Reflection Films Anti-Rainbow and Anti-Blackout Films Anti-Reflection Films Sensor films for large-screen touch panel Other New Materials Thermosetting stretchable film BEYOLEX 소재 AMTETRA Antistatic Film AMTECLEAN A AMTECLEAN Z 32bit Inverter Control MN103H 32bit Inverter Control MN103S 32bit Low Power MN103L 8bit Low Power MN101E 8bit Low Power MN101C 8bit Ultra Low Power MN101L Arm® Cortex®-M7 MCUs MN1M7 Human Machine Interface Display LSIs Audio Integrated LSIs Blu-ray Disc™ NFC Tag LSIs NFC Tag Modules Secure IC LED Driver ICs for Lighting LED Driver ICs for Amusements LED Driver ICs for Illumination Stepping Motor Driver ICs 3-Phase Brushless DC Motor Driver ICs 1-Phase Brushless DC Motor Driver ICs Brushed DC Motor Driver ICs (단종제품) Lens Driver ICs for camcorder and camera MOSFETs for Lithium-ion Battery Protection MOSFETs for General Switching MOSFETs for Automotive Cell Balancing MOSFETs for Automotive Switching Circuit Other MOSFETs White LEDs (단종제품) Surface-mount LEDs (단종제품) Lamp LEDs (단종제품) Ambient Light Sensors (단종제품) Front Monitors (단종제품) Remote Control Receivers (단종제품) IrDAs (단종제품) Red and Infrared (IR) Dual Wavelength Laser Diodes Red Laser Diodes (단종제품) Infrared (IR) Laser Diodes (단종제품) Image Sensors for Security, Industry and Medical Use Image Sensors for Broadcasting and Digital Still Camera 3D Sensing Solution (ToF) Low Noise Amplifiers (LNA) Power Amplifier for Handsets (PA) (단종제품) GaN Power Devices (단종제품) AC-DC converter / Power supply IC (IPD) DC-DC Module with built-in Inductor (PSiP) (단종제품) DC-DC Regulators with built-in MOS (단종제품) DC-DC Regulator for Car-AV and Industry Battery Monitoring IC Epoxy Resin Insulation Sheet Materials "ECOM Fine Sheet" TM/TL Series TAWERS Series others LED Lighting Connectors Thermoelectric Cooling Roller

검색

2025

• 4월
  21일
  Information
  MEGTRON7 Qualified for PCB at European Space Agency ESA

2023

• 10월
  18일
  Information
  Panasonic Industry Demonstrates Durability of Electronic Materials in Exposure Experiments in Harsh Space Environment
• 3월
  16일
  Information
  Panasonic's Cutting-edge Electronic Materials for Aerospace Applications to Be Launched for Space Exposure Experiments

2022

• 8월
  25일
  Information
  Panasonic Engages in Joint Research on Ultra-light EMC Shielding Material Development with JAXA
• 6월
  22일
  Information
  Panasonic to Conduct Space Exposure Experiments Aiming to Develop Cutting-edge Electronic Materials for Aerospace Applications
• 1월
  18일
  Information
  Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment

2021

• 6월
  22일
  New product
  Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
• 3월
  2일
  New product
  Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
• 2월
  25일
  New product
  Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas

2019

• 1월
  21일
  Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment

2018

• 12월
  13일
  To Bolster Substrate Material Business in North East Asian Region
• 9월
  3일
  Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
• 8월
  29일
  Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
• 6월
  4일
  Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
• 5월
  29일
  Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
• 3월
  9일
  Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
• 2월
  8일
  Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
• 1월
  11일
  Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas

2017

• 6월
  1일
  Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
• 5월
  12일
  Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
• 2월
  3일
  Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
• 1월
  17일
  Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials

2016

• 12월
  27일
  Price Revision for Copper clad Laminates and Mass Laminations
• 12월
  22일
  Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
• 8월
  25일
  Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
• 5월
  30일
  Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
• 5월
  26일
  Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
• 4월
  5일
  Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
• 3월
  18일
  Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
• 3월
  3일
  Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires