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EMC대책부품・ 회로보호부품
센서
입력 디바이스・스위치
반도체
릴레이・커넥터
FA용 센서 및 디바이스
모터, 컴프레서
기억 미디어
커스텀・모듈
FA・용접기
Batteries (for Business)
전자재료
소재
어플리케이션 가이드
어플리케이션 가이드
차량용
공조 시스템
클러스터 HUD
차체 컨트롤 모듈
카 AV 시스템
전기차 충전 시스템
배터리 관리 시스템
파워 윈도 모듈
블랙 박스
전동 바이크
타이어 공기압 모니터링 시스템
차량 비상 호출 시스템
산업용
복합기 프린터 (MFP)
Programmable Logic Controller (PLC)
3D 프린터
전동 공구
파워 컨디셔너
자율배송 로봇
산업용 로봇
솔루션
AC 서보 모터
무정전 전원 장치 (UPS)
공공 인프라
감시 카메라
생체 인식
가스 미터
수도 미터
기지국 스몰셀
디지털 사이니지
가전
LED 조명(실링 라이트)
스마트 미터
에어컨
홈 에너지 관리 시스템
냉장고
세탁기
가정용 태양광 발전
가정용 ESS
전자레인지
AV/컴퓨팅
프로젝터
스마트폰
웨어러블 기기
태블릿
헬스케어
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전동 칫솔
보청기
다운로드
다운로드
Products Catalog
RoHS / REACH Confirmation Report
CAD Data
Circuit Simulation Data
Power Inductors
SP-Cap/Conductive Polymer Aluminum Capacitors
POSCAP/Conductive Polymer Tantalum Solid Capacitors
OS-CON/Conductive Polymer Aluminum Solid Capacitors
Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
Surface Mount Type Aluminum Electrolytic Capacitors
Common mode Noise Filters
Chip Varistors
Varistors (ZNR Surge Absorber)
ESD Suppressor/ ESD Suppressor Array
Battery Product Safety Data Sheet
Lithium battery UN38.3 Test Summary
설계지원
설계지원
Product selection support
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Solutions
Optimal solution for circuit design
Device Solutions
Noise / Thermal Solutions
Thermal solutions
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Panasonic Korea
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Buy or Sample
공지 사항
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카테고리를 선택해 주시기 바랍니다
선택해주시기 바랍니다
콘덴서(캐패시터)
- 전도성 고분자 콘덴서
- - Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
- - Conductive Polymer Tantalum Solid Capacitors (POSCAP)
- - Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- - Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- 알루미늄 전해 콘덴서
- - Conductive Polymer Aluminum Solid Capacitors (OS-CON)
- - Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
- - Aluminum Electrolytic Capacitors (Surface Mount Type)
- - Aluminum Electrolytic Capacitors (Radial Lead Type)
- 전기 2중층 콘덴서(골드 캐퍼시터)
- - Electric Double Layer Capacitors (Multilayer Coin Type) (단종제품)
- 필름 콘덴서
- - Film Capacitors (Electronic Equipment Use)
- - Film Capacitors (AC Motor Use)
- - Film Capacitors (Automotive, Industrial and Infrastructure Use)
저항
- 칩저항기
- - High Temperature Chip Resistors
- - High Precision Chip Resistors
- - Current Sensing Chip Resistors
- - Small & High Power Chip Resistors
- - Anti-Sulfurated Chip Resistors
- - General Purpose Chip Resistors
- - Resistor Network
- 그 외 저항기
- - Attenuator
- - Thermal Sensitive Resistors (단종제품)
- - Trimmer Potentiometers (단종제품)
인덕터(코일)
- Power Inductors for Automotive application
- Power Inductors for Consumer
- Multilayer type Power Inductors (단종제품)
- Voltage Step-up Coils
- Choke Coils (단종제품)
- Chip Inductors (단종제품)
열대책
- Thermal protection sheet (Graphite Sheet (PGS)/PGS applied products/NASBIS)
- NTC Thermistor (Chip type)
- Cooling Fan with Unique Hydro Dynamic Bearing
- 전자회로기판재료
- - Circuit Board Materials for LED lightings "ECOOL" series
EMC대책부품・ 회로보호부품
- EMC대책부품
- - Common mode Noise Filters
- - EMI Filters (단종제품)
- - Electromagnetic Wave Shield Film
- 회로보호부품
- - ESD Suppressor
- - Chip Varistor
- - Varistors (ZNR Surge Absorber)
- - Fuses
센서
- 일반 센서
- - MR Sensor
- - 6DoF Inertial Sensor for Automotive (6in1 Sensor)
- - Gyro Sensors
- - Temperature Sensors (Automotive use)
- 기기용 센서
- - Infrared Array Sensor Grid-EYE
- - PS-A Pressure Sensors (built-in amplification and temperature compensating circuit)
- - PS Pressure Sensors
- - PF Pressure Sensors
- - 1-axis accelerometer GF1 (단종제품)
- - Light Sensor NaPiCa (단종제품)
- - GS2 Acceleration Sensor (단종제품)
- - GS1 Acceleration Sensor (단종제품)
- - PM2.5 Sensors
- - PIR Motion Sensor PaPIRs
- FA용 센서
입력 디바이스・스위치
- 스위치
- - Detector Switches
- - Push Switches
- - Tactile Switches (Light Touch Switches)
- - Power Rocker Switches(Not applicable)
- - Seal Type Switches(Not applicable)
- - Non Seal Type Switches(Not applicable)
- - Limit Switches(Not applicable)
- - Snap Switches(Not applicable)
- - Fall Detection Switches(Not applicable)
- 감압 스위치
- - Force Sensing Capacitive Device(Not applicable)
- 엔코더, 볼륨
- - Encoders
- - Automotive Encoders
- - Rotary Potentiometers
- - Automotive Rotary Potentiometers
- - Position Sensors
- Touch Panels
반도체
- 마이크로 컴퓨터
- - 32bit Inverter Control MN103H
- - 32bit Inverter Control MN103S
- - 32bit Low Power MN103L
- - 8bit Low Power MN101E
- - 8bit Low Power MN101C
- - 8bit Ultra Low Power MN101L
- - Arm® Cortex®-M7 MCUs MN1M7
- Audio & Visual
- - Human Machine Interface Display LSIs
- - Audio Integrated LSIs
- NFC Tag & Secure IC
- - NFC Tag LSIs
- - NFC Tag Modules
- - Secure IC
- LED 드라이버 IC
- - LED Driver ICs for Lighting
- - LED Driver ICs for Amusements
- - LED Driver ICs for Illumination
- 모터 드라이버 IC
- - Stepping Motor Driver ICs
- - 3-Phase Brushless DC Motor Driver ICs
- - 1-Phase Brushless DC Motor Driver ICs
- - Brushed DC Motor Driver ICs (단종제품)
- - Lens Driver ICs for camcorder and camera
- MOSFETs
- - MOSFETs for Lithium-ion Battery Protection
- - MOSFETs for General Switching
- - MOSFETs for Automotive Cell Balancing
- - MOSFETs for Automotive Switching Circuit
- - Other MOSFETs
- Light Emitting Diodes (단종제품)
- - White LEDs (단종제품)
- - Surface-mount LEDs (단종제품)
- - Lamp LEDs (단종제품)
- Photo Detectors (단종제품)
- - Ambient Light Sensors (단종제품)
- - Front Monitors (단종제품)
- - Remote Control Receivers (단종제품)
- - IrDAs (단종제품)
- 레이저 다이오드
- - Red and Infrared (IR) Dual Wavelength Laser Diodes
- - Red Laser Diodes (단종제품)
- - Infrared (IR) Laser Diodes (단종제품)
- 이미지 센서
- - Image Sensors for Security, Industry and Medical Use
- - Image Sensors for Broadcasting and Digital Still Camera
- - 3D Sensing Solution (ToF)
- 고주파 디바이스
- - Low Noise Amplifiers (LNA)
- - Power Amplifier for Handsets (PA) (단종제품)
- 파워 디바이스
- - GaN Power Devices (단종제품)
- - AC-DC converter / Power supply IC (IPD)
- - DC-DC Module with built-in Inductor (PSiP) (단종제품)
- - DC-DC Regulators with built-in MOS (단종제품)
- - DC-DC Regulator for Car-AV and Industry
- - Battery Monitoring IC
- Other semiconductors (단종제품)
릴레이・커넥터
- 릴레이・커플러
- - PhotoMOS
- - Power Relays (Over 2A)
- - Safety Relays
- - Solid State Relays (SSR)
- - Signal Relays (2A or less)
- - Microwave Devices (Microwave Relays/Coaxial Switches)
- - Automotive Relays
- - High-capacity DC Cutoff Relays
- - PhotoIC Coupler(Not applicable)
- - Interface Terminal
- 커넥터
- - Narrow Pitch Connector for board to FPC
- - Narrow Pitch Connector for board to board
- - High Current Connectors
- - FPC/FFC Connectors
- - Active Optical Connectors
FA용 센서 및 디바이스
- FA용 센서
- - 화이버 센서
- - 라이트 커튼ᆞ안전 기기
- - 에어리어 센서
- - 빔 센서(광전 센서)ᆞ레이저 센서
- - 마이크로 포토 센서
- - 근접 센서
- - 압력ᆞ유량 센서
- - 검사ᆞ판별ᆞ측정용 센서(변위 센서)
- - 특수 용도 센서
- - 센서 주변 기기
- - 배선 절감 시스템
- FA 디바이스
- - 정전기 대책 기기
- - 에너지 절감 지원 기기
- - PLCᆞ터미널
- - 표시기
- - 화상 처리기
- - UV 조사기(자외선 경화 장치)
- - 레이저 마킹기・2차원 코드 리더
- - FA 컴포넌트
모터, 컴프레서
- FA・일반 산업용 모터
- - AC 서보 모터・앰프
- - 산업용 브러시리스 모터・앰프
- - 소형 기어드 모터
- 가전용・전장용 모터
- - Motors for Air Conditioning
- - Motors for Vacuum Cleaner
- - Motors for Refrigerator
- - Motors for Automotive
- 컴프레서
- - Reciprocating Compressors (Fixed Speed)
- - Reciprocating Compressors (Variable Speed)
- - Rotary Compressors (Fixed Speed)
- - Rotary Compressors (Variable Speed)
- - Scroll Compressors (Fixed Speed)
- - Scroll Compressors (Variable Speed)
- DC Pumps
기억 미디어
- 기억 미디어
- - Blu-ray Disc™
커스텀・모듈
- 광부품
- - Aspherical Glass Lenses
- 커스텀 부품
- - Chip Ring
- 모듈 디바이스
- - Ultrasonic Gas Flow Sensor GB-L1CM1
FA・용접기
- FA
- - Electronic Component Mounting-related Systems
- - Device-related Systems
- - Display-related Systems
- 용접기, 로봇 시스템
- - 아크 용접기
- - 로봇 시스템
- - Laser Processing
- FA 디바이스
Batteries (for Business)
- 이차 전지(충전 가능)
- - Lithium-ion Batteries
- - Nickel Metal Hydride Batteries
- - Ni-Cd Batteries (Cadnica)
- - Coin-type Rechargeable Lithium Batteries
- - Pin-type Lithium-ion Batteries
- 일차 전지
- - Lithium Batteries
- - Zinc Carbon and Alkaline Batteries
전자재료
- 전자회로기판재료
- - Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
- - High frequency circuit board materials for wireless/RF applications "XPEDION"series
- - Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
- - Circuit Board Materials for LED lightings "ECOOL" series
- - Flexible Circuit Board Materials for Mobile Products "FELIOS" series
- - Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
- - Glass Epoxy Multi-layer Circuit Board Materials
- - Mass laminations(Shield board) "PreMulti"
- - Glass Composite Circuit Board Materials
- - Paper Phenolic Circuit Board Materials
- Semiconductor Device Materials
- - IC Substrate Materials "LEXCM GX" series
- - Semiconductor Packaging Encapsulation Materials for Advanced Package
- - Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
- - Liquid Materials for Board level Underfill, Adhesives
- 플라스틱 성형재료
- - Plastic Molding Compound for LED "FULL BRIGHT" series
- - High heat resistance Phenolic Molding Compound for Automotive Components
- - High fluidity LCP resin Molding Compound for Mobile Products
- - High heat dissipation Unsaturated Polyester resin Molding Compound for Automotive Components
- - Long-term reliable PBT Molding Compound for Automotive Components
- - Urea molding compounds
- - Melamine molding compounds
- 기능 필름
- - Advanced Functional Films for Automotive Applications
- - Sensor films for large-screen touch panel
- Other New Materials
- - Thermosetting stretchable film BEYOLEX
소재
- Pana-Tetra Zinc Oxide Single Crystal
- Pana-Tetra Compound Resin
- Pana-Tetra Electrification Prevention Film
- "AMTECLEAN A" Cleaning Agent for Injection Molding Machines
- "AMTECLEAN Z" Inorganic Antimicrobial Agent
- - Epoxy Resin Insulation Sheet Materials "ECOM Fine Sheet"
- - TM/TL Series
- - TAWERS Series
- - others
- LED Lighting Connectors
- - Thermoelectric Cooling Roller
검색
2022
1월
18일
Information
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
2021
6월
22일
New product
Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
3월
2일
New product
Panasonic Commercializes Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement
2월
25일
New product
Panasonic Commercializes R-5410 Halogen-free Ultra-low Transmission Loss Multi-Layer Circuit Board Material for Millimeter-Wave Antennas
2020
10월
12일
Panasonic Commercializes an Anti-Glare Type Anti-Reflection Film for Automotive Displays
2019
1월
21일
Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment
2018
12월
13일
To Bolster Substrate Material Business in North East Asian Region
9월
3일
Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
8월
29일
Panasonic Commercializes Granular Epoxy Mold Compound (EMC) Semiconductor Encapsulation Materials for FOWLP and PLP
6월
4일
Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
5월
29일
Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
3월
9일
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
2월
8일
Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
1월
11일
Panasonic Develops "Halogen-free Ultra-low Transmission Loss Circuit Board Material" for Millimeter-wave Band Antennas
2017
6월
1일
Panasonic Commercializes "High Thermal Conductivity, Low Transmission Loss Halogen-free Multi-layer Circuit Board Material" for Wireless Base Stations
5월
12일
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
2월
3일
Panasonic Develops Low-temperature Curing Secondary Mounting Underfill Material that Improves Mounting Reliability of Automotive Parts
1월
17일
Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
2016
12월
27일
Price Revision for Copper clad Laminates and Mass Laminations
12월
22일
Panasonic Commercializes High Heat Resistance Halogen-free Multi-layer Circuit Board Material for Automotive Use
10월
18일
Panasonic Commercializes "Double-side Copper Laminate Polyethylene Terephthalate (PET) Films" for Large-screen Touch Panel Sensor
8월
25일
Panasonic Commercializes "Time-lagged UV Curing Adhesive" Suitable for Assembly of Mobile Phone Housings and UV-Protection Panels
5월
30일
Panasonic Commercializes a Substrate Material for Semiconductor Packages Featuring Reduced Internal Stress that Leads to Lower Warpage
5월
26일
Panasonic Commercializes "Sheet-Form Encapsulation Material for Coreless Package Substrates"
4월
5일
Panasonic Develops Light Diffusion Polypropylene Resin Molding Compounds "FULL BRIGHT" PP
3월
18일
Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
3월
3일
Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
2월
12일
Panasonic Commercializes Polybutylene Terephthalate (PBT) Molding Compounds for Laser Welding
2015
12월
24일
Panasonic Develops a Stretchable Resin Film and Its Application Materials For Stretchable Electronics
10월
1일
Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices
Pagination
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