For high heat resistance power devices semiconductor encapsulation materials | CV8540 series

For high heat resistance power devices semiconductor encapsulation materials

 

  1. By adopting a new epoxy system, this material has excellent heat resistance and can be applied to the next generation power devices (SiC, GaN).
  2. Contribute to improving power module performance and reliability under high temperature environment.

Semiconductor Encapsulation Materials/Adhesive

  •  Part Number 

CV8540 series

  • Application
  • Detailed use
Package
Automotive
・Package
・Automotive
Power devices used in industry/Automotive inverters

Properties

High heat resistance
Low warpage, Low stress
High insulation

Concept

Concept

High heat resistance

High heat resistance

Dielectric property (Tg dependence)

Dielectric property (Tg dependence)

General properties

Item Unit CV8540 series
Feature Middle CTE & Low modulus type Low CTE & Low modulus type
C.T.E. (α1/α2) ppm/°C 14/65 11/60
Tg (TMA) °C 210 210
Flexural strength (RT/260°C) MPa 110/23 100/21
Flexural modulus (RT/260°C) GPa 13/1.0 13/1.0
Cure condition 175°C/100-150sec
Post mold cure 175-200°C/4-8hr (200°C/4hr for above properties)
UL flammability UL-94 V-0 V-0

The above data are typical values and not guaranteed values.

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