Reduces the load of customers' circuit formation. Contribute to the impedance matching and crosstalk prevention by increasing flexibility of board design.
Possible to be high multi-layered up to 24 layers.
Quick delivery from order to shipment.
Circuit Board Materials
- Part Number
- Detailed use
Automotive component, Mobile product(PC and related equipment, Mobile phone, Laptop etc.), Amusement machine, Digital appliance, Measuring instrument, Semiconductor test equipment, Semiconductor memory board, etc.
AOI inspection for
What's Mass laminations?
|C-1810||Glass epoxy resin shield board used R-1766 material|
|C-1510||Halogen-free shield board used R-1566 material|
|C-1850D||High heat resistance shield board for Automotive component used R-1755D material|
|C-1850S||High heat resistance shield board for ICT infrastructure equipment used R-1755S material|
|Dimensional tolerance between the reference mark||±0.15mm|
|Accuracy of the layer reach||0.15mm or less|
|Warpage||1% or less of the long side|
|Line/Space||Copper thickness 12μm: 50/50μm
Copper thickness 18μm: 50/50μm
Copper thickness 35μm: 75/75μm
Copper thickness 70μm: 100/100μm
Copper thickness 105μm: 150/150μm
※The above data is general specifications. Please contact us for more specifications.
The above data are typical values and not guaranteed values.