![For power modules high thermal conductive semiconductor encapsulation materials](/content/data/EM/pictures/ww_olimg_ecompow.jpg)
- Achieving high mountability and high heat dissipation → Package warpage control
- Suitable for large packages with heat spreaders exposed → T/C resistance improvement due to stress reduction
- Compatible with nickel plating → Achieved high adhesion
Semiconductor Encapsulation Materials
- Part Number
![LEXCM CF](/content/data/EM/pictures/logo_lexcm_cf.gif)
CV4180 CV4380
- Application
- Detailed use
![Package](/content/data/EM/pictures/pict_sem_pkg.gif)
![Automotive](/content/data/EM/pictures/pict_sem_aut.gif)
・Package
・Automotive
・Automotive
Automotive module, Inverter module for major appliances and industrial motors
Properties
High heat dissipation
Stress reduction
High adhesion
EMC (Epoxy Molding Compound) explainer video
Stress reduction:Thermal cycle(T/C) resistance
![Stress reduction:Thermal cycle(T/C) resistance](/content/data/EM/pictures/ww_img_ecompow_01.jpg)
Nickel plating adhesion:Shear adhesive strength
![Nickel plating adhesion:Shear adhesive strength](/content/data/EM/pictures/ww_img_ecompow_02.jpg)
Line-up
Part Number | Applications | Features |
---|---|---|
CV3300 / CV4380 | Encapsulation of fully-molded module | High thermal conductive grade(1.7∼2.3 W/mK) |
CV4500 / CV4580 | Super high thermal conductive grade(3.0∼3.5 W/mK) | |
CV4100A/CV4180A | Encapsulation of module with heat spreader exposed | Low stress type for metallic substrates |
CV4100B/CV4180B | Low stress type for ceramic substrates |