- Achieved delamination free* with high adhesion strength and low stress property.
- High heat resistance for automotive application(AEC-Q100/grade0)
Semiconductor Encapsulation Materials
- Part Number
CV8213 series
- Application
- Detailed use
・Package
・Automotive
・Automotive
Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL
Properties
Delamination free*
with high adhesion and low stress
with high adhesion and low stress
Automotive quality
AEC-Q100/grade 0
AEC-Q100/grade 0
Also used for Clip-Bond Package
of automotive application
of automotive application
EMC (Epoxy Molding Compound) explainer video
Concept
Delamination free* achieved by MRT(Moisture reflow test）
Delamination free* achieved at 1000 cycles of TCT(Thermal Cycle Test)
General properties
| Item | Unit | CV8213 series |
| Tg | °C | 125 |
| C.T.E. (α1/α2) | ppm/°C | 10/46 |
| Flex. Modulus (260°C) | GPa | 0.4 |
| Moisture Absorption | % | 0.13 |
| pH | – | 7.0 |
The above data are typical values and not guaranteed values.
- *Delamination free
- 1. Based on Panasonic's internal evaluation samples. No separation observed between the lead frame and the semiconductor encapsulation material were detected using on measurements made using SAT (Scanning Acoustic Tomography) Equipment.
- 2. Panasonic does not guarantee that no delaminated parts will be detected under any evaluation conditions.
- 3. With respect to delamination, the company recommends that all users evaluate the stability of parts and make a decision with respect to adoption.
