- Contribute to thin IC package by ultra-thin material and decrease the substrate warpage by low CTE property
Semiconductor Device Materials
- Part Number
- Application
- Detailed use
・IC substrate
CSP (DRAM, NAND/PMIC, Mini LED, etc.)
FC-CSP (APU, RF-IC, etc.)
FC-CSP (APU, RF-IC, etc.)
New part number
Laminate R-151YE
Prepreg R-141YE
Existing part number
Laminate R-1515E
Prepreg R-1410E
- There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
Properties
Flexural modulus
25°C 33GPa
25°C 33GPa
CTE x, y-axis
9ppm/°C
9ppm/°C
Tg (DMA)
270°C
270°C
Package warpage(FBGA)
Thermal expansion (x-axis)
General properties
| Item | Test method | Condition | Unit | LEXCM GX R-151YE R-1515E |
|
|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA*² | A | °C | 270 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 390 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 9 |
| CTE y-axis | 9 | ||||
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | 22*¹ | |
| α2 | 95*¹ | ||||
| Flexural modulus | JIS C 6481 | 25°C | GPa | 33*¹ | |
| 250°C | 18*¹ | ||||
The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
Related information
[ Product summary ]
- New part number
- Existing part number
Download PDF- Download PDF
[ Data Sheet ]
- New part number
- Existing part number
- IPC Standards R-151YE (English document)
- IPC Standards R-1515E (English document)
