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IC Substrate Materials "LEXCM GX" series

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Contribute to IC substrates as thinner and smaller and low warpage.
  • There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
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LEXCM GX Line-up

General properties

Item  Test method Condition Unit R-1515V R-1515K R-1515W
Glass transition temp(Tg) DMA*² A °C 260 260 250
CTE x-axis / y-axis α1 Internal method A ppm/°C 3-5 7 9
Dielectric constant(Dk)*¹ 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 － 4.4 4.6 4.8
Dissipation factor(Df)*¹ 0.016 0.015 0.015
Flexural modulus*¹ JIS C 6481 25°C GPa 30 27 35
250°C 14 12 21
Item  Test method Condition Unit R-1515A R-G545L R-G545E
Glass transition temp(Tg) DMA*² A °C 205 230 230
CTE x-axis / y-axis α1 Internal method A ppm/°C 12 10 10
Dielectric constant(Dk)*¹ 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 － 4.8 3.6 4.1
Dissipation factor(Df)*¹ 0.015 0.002 0.002
Flexural modulus*¹ JIS C 6481 25°C GPa 27 23 27
250°C 10 10 13
Item  Test method Condition Unit R-G515S R-G515E R-151YE
R-1515E
Glass transition temp(Tg) DMA*² A °C 220-240 220-240 270
CTE x-axis / y-axis α1 Internal method A ppm/°C 4-6 6-8 9
Dielectric constant(Dk)*¹ 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 － 4.2 4.4 4.7
Dissipation factor(Df)*¹ 0.008 0.008 0.011
Flexural modulus*¹ JIS C 6481 25°C GPa 28 24 33
250°C － － 18

The sample thickness is 0.1 mm.
*1 0.8mm
*2 Measurement in tensile mode. R-1515W, R-1515A: Measurement in bending mode.

The above data are typical values and not guaranteed values.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

Related information

[ Product summary ]

[ Common information ]