- Improved solder joint reliability by excellent connect reliability material.
- Available for high voltage application by good to insulation reliability.
Circuit Board Materials
- Part Number
Highly heat resistant Low CTE
multi-layer circuit board
materials <High-Tg type>
Laminate R-1755D
Prepreg R-1655D
- Application
- Detailed use
・Automotive
Automotive ECU, etc.
Properties
Tg (DSC)
163°C
163°C
Td (TGA)
345°C
345°C
CTE x-axis
10-12ppm/°C
10-12ppm/°C
Positioning of Glass transition temperature(Tg)
Through-hole reliability
Insulation reliability
General properties
| Item | Test method | Condition | Unit | HIPER M R-1755D |
Conventional FR-4 R-1766 |
|
|---|---|---|---|---|---|---|
| Glass transition temp (Tg) | DSC | A | °C | 163 | 140 | |
| Thermal decomposition temp (Td) | TG/DTA | A | °C | 345 | 315 | |
| CTE x-axis | α1 | IPC TM-650 2.4.41 | A | ppm/°C | 10-12 | 11-13 |
| CTE y-axis | 12-14 | 13-15 | ||||
| CTE z-axis | α1 | IPC TM-650 2.4.24 | A | 43 | 65 | |
| α2 | 236 | 270 | ||||
| T288 (with copper) | IPC TM-650 2.4.24.1 | A | min | 15 | 1 | |
| Dielectric constant (Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | – | 4.4 | 4.3 |
| Dissipation factor (Df) | 0.016 | 0.016 | ||||
| Water absorption | IPC TM-650 2.6.2.1 | D-24/23 | % | 0.11 | 0.14 | |
| Flexural modulus | Warp | JIS C6481 | A | GPa | 23 | 23 |
| Fill | 21 | 21 | ||||
| Peel strength | 1oz | IPC TM-650 2.4.8 | A | kN/m | 1.3 | 2.0 |
| Flammability | UL | – | – | 94V-0 | 94V-0 | |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
