Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M | R-1755M

Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type> HIPER M R-1755M

 

  1. Improved connection reliability of circuit board for automotive by good CAF resistance.
  2. Available for high voltage and industry application.

Circuit Board Materials

  • Part Number

Laminate R-1755M
Prepreg R-1650M

  • Application
  • Detailed use
Automotive
Industry
・Automotive
・Industry
Automotive component(ECU board), Photovoltaic(Inverter), Electronic equipment requiring high reliability(using lead-free solder), etc.

Properties

Tg (DSC)
153°C
Td (TGA)
355°C
CTE x-axis
40ppm/°C

Positioning of Glass transition temperature(Tg)

Positioning of Glass transition temperature(Tg)

Through-hole reliability

Through-hole reliability

Insulation reliability

Insulation reliability

General properties

Item Test method Condition Unit   HIPER M  
R-1755M
Conventional
FR-4
R-1766
Glass transition temp.(Tg) DSC A °C 153 140
Thermal decomposition temp.(Td) TGA A °C 355 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13 11-13
CTE y-axis 13-15 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 40 65
α2 240 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 18 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.6 4.3
Dissipation factor (Df) 0.014 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.11 0.14
Flexural modulus Warp JIS C6481 A GPa 24 23
Fill 22 21
Peel strength 1oz(35μm) IPC TM-650 2.4.8 A kN/m 1.5 2.0
Flammability UL C-48/23/50 94V-0 94V-0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.

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