- This high thermal conductive bonding sheet will contribute to light weight of product and thermal dissipation at parts of heat generation.
Circuit Board Materials
- Part Number
New part number R-14TY
Existing part number R-14T1
- Application
- Detailed use
・Automotive
・Appliance
・Appliance
Heat dissipation of Automotive application(LED lighting), Industry equipment, etc.
- There might be some differences in UL certification conditions between the existing part numbers and the new part numbers. Please contact a sales representative in charge or this form for the detail.
Any letters with parentheses ( ) at the end of a part number are for identification code in our company and are not included in the part numbers registered for UL certification.
Properties
Thermal Conductivity
1.4W/m・K
1.4W/m・K
CTI≧600V
Halogen-free
Thermal dissipation property
Line-up
General properties
| Item | Test method | Condition | Unit | R-14TY R-14T1 |
Conventional R-1661 |
|
| Thermal conductivity | Laser flash | A | W/m･K | 1.4 | 0.4 | |
| Glass transition temp.(Tg) | DSC | A | °C | 148 | 140 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 350 | 315 | |
| CTE x-axis | α1 | IPC-TM-650 2.4.41 | C-24/23/50 | ppm/℃ | 19-21 | 11-13 |
| CTE y-axis | 19-21 | 13-15 | ||||
| CTE z-axis | IPC-TM-650 2.4.24 | 27 | 65 | |||
| Tracking resistance | IEC 60112 | A | V | ≧600 | 175-249 | |
| Flexural modulus | Fill | JIS C 6481 | A | GPa | 25 | 21 |
| Flexural strength | Fill | JIS C 6481 | A | MPa | 230 | 490 |
The sample thickness is 0.08mm(RC:86%)
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
