- Enhances process reliability by warpage control and high adhesion
→ Low warpage of ultrathin module is achieved
- Solder flash during mounting reflow has been reduced, resulting in greatly decreasing the defect ratio
- Large encapsulation area
Semiconductor Encapsulation Materials/Adhesive
- Part Number
- Detailed use
Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC.
Reduced solder flash
Warpage behavior:Shadow moire analysis
Solder flash after mounting reflow has been reduced (X-ray observation)
The above data are typical values and not guaranteed values.