![Capillary Underfill(CUF) Semiconductor encapsulation materials](/content/data/EM/pictures/olimg_ecomfffl.jpg)
- Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity.
Semiconductor Encapsulation Materials
- Part Number
![LEXCM DF](/content/data/EM/pictures/logo_lexcm_df.gif)
CV5300 series
- Application
- Detailed use
![Package](/content/data/EM/pictures/pict_sem_pkg.gif)
![Mobile](/content/data/EM/pictures/pict_sem_mob.gif)
・Package
・Mobile
・Mobile
High-density Advanced IC Packages(BGA, CSP, etc.)
Properties
High fluidity
Excellent fillability
for Narrow gap/pitch
for Narrow gap/pitch
Reduced void/bleed
Line-up
![Line-up](/content/data/EM/pictures/ww_img_ecomfffl_01_2212.jpg)
Excellent fillability for Narrow gap/pitch
![Excellent fillability for Narrow gap/pitch](/content/data/EM/pictures/ww_img_ecomfffl_02.jpg)
Reduced void/bleed
![Reduced void/bleed](/content/data/EM/pictures/ww_img_ecomfffl_03.jpg)
General properties
Item | Unit | CV5300 series |
Filler size Max | μm | 1 |
C.T.E. | ppm/℃ | 33 |
Tg (TMA) | ℃ | 110 |
Modulus | GPa | 7 |
The above data are typical values and not guaranteed values.