- Capillary underfill material with reduced void, that realizes underfilling to the narrow gap and pitch by high fluidity.
Semiconductor Encapsulation Materials
- Part Number
CV5300 series
- Application
- Detailed use
・Package
・Mobile
・Mobile
High-density Advanced IC Packages(BGA, CSP, etc.)
Properties
High fluidity
Excellent fillability
for Narrow gap/pitch
for Narrow gap/pitch
Reduced void/bleed
Line-up
Excellent fillability for Narrow gap/pitch
Reduced void/bleed
General properties
| Item | Unit | CV5300 series |
| Filler size Max | μm | 1 |
| C.T.E. | ppm/℃ | 33 |
| Tg (TMA) | ℃ | 110 |
| Modulus | GPa | 7 |
The above data are typical values and not guaranteed values.
