Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.
The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials
(which includes substrates, encapsulants and underfills) and electronic assembly materials.
Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Major application | Product name | Product number | Features / Proposals | Detailed application | |
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![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() series |
Contribute to IC substrates as thinner and smaller and low warpage | ||
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Ultra-low transmission loss Circuit board materials for IC substrate/Module | ![]() Laminate : R-G545L, R-G545E Prepreg : R-G540L, R-G540E |
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High modulus Low CTE IC substrate materials | ![]() Laminate : R-G535S, R-G535E |
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Low CTE Ultra-thin IC substrate materials | ![]() Laminate : R-G515S, R-G515E Prepreg : R-G510S, R-G510E |
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![]() IC package |
Low CTE IC substrate materials Designed to Improve Reliability | ![]() Laminate : R-1515V,R-1515K |
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![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515W Prepreg : R-1410W |
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![]() IC package |
Narrow pitch corresponding circuit board materials | ![]() Laminate : R-1515A Prepreg : R-1410A |
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Ultra-thin circuit board materials | ![]() Laminate : R-1515E Prepreg : R-1410E |
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Semiconductor Encapsulation Materials
Semiconductor Packaging Encapsulation Materials for Advanced Package
Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc.
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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![]() IC package |
Semiconductor Packaging Encapsulation Materials for Advanced Package | Contribute to improving the reliability of advanced semiconductor package such as wafer level package, FC CSP/BGA, Wifi module, etc. | |||
![]() ![]() IC package Mobile products |
Encapsulation Materials for FOWLP/PLP | ![]() CV8511C ![]() CV2308 ![]() CV5788 |
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Over-molding and wafer back-coating of advanced semiconductor packages, such as WLPs (FOWLPs and FIWLPs) and PLPs, for sophisticated mobile and wearable devices | |
![]() ![]() IC package Mobile products |
Molded Underfill(MUF) Semiconductor encapsulation Molding compounds | ![]() CV8710 CV8713 |
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Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.) | |
![]() ![]() IC package Mobile products |
Capillary Underfill(CUF) Semiconductor encapsulation materials | ![]() CV5300 CV5350 |
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High-density Advanced IC Packages(BGA, CSP, etc.) | |
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Thin surface mounting semiconductor encapsulation materials | ![]() CV8710 CV8760 |
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High-density, advanced package for mobile devices(PoP,MCP,Mold underfill package, etc.) | |
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For SMD module low warpage liquid encapsulant | ![]() CV5386 CV5401 |
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Communication module (MAP, COB) for mobile devices such as notebook PC, digital camera, mobile phone, smartphone, tablet PC. |
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment
Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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![]() IC package |
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment | Contribute to improving the reliability of semiconductor package such as a power device requiring automotive quality | |||
![]() ![]() IC package Automotive components |
For Automotive IC package Delamination free surface mounting semiconductor encapsulation materials | ![]() CV8213 series |
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Surface mounting PKG: SOP, QFP, LQFP, DPAK, LFPAK, TOLL | |
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For power modules high thermal conductive semiconductor encapsulation materials | ![]() CV4180 CV4380 |
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Inverter module for major appliances and industrial motors, Automotive module | |
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For high heat resistance power devices semiconductor encapsulation materials | ![]() CV8540 series |
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Power devices used in industry/Automotive inverters |
Liquid Materials for Board level Underfill, Adhesives
Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor
Major application | Product name | Product number | Features / Proposals | Detailed application | |
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![]() IC package |
Liquid Materials for Board level Underfill, Adhesives | Secondary mounting reinforcement of semiconductor package such as CSP/BGA, Adhesive bonding of camera module/image sensor | |||
![]() ![]() IC package Automotive components |
High heat resistance Secondary mounting Sidefill materials | ![]() CV5797 series |
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Surface mounting PKG: CSP, BGA, WLCSP, QFN, MLCC, Image sensor, etc. | |
![]() ![]() IC package Automotive components |
High heat resistance Secondary mounting Underfill materials | ![]() CV5794 series |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU | |
![]() ![]() IC package Automotive components |
Low-temperature curing Secondary mounting Underfill materials | ![]() CV5350AS |
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Mount reinforcement of semiconductor packages and electronic parts for Automotive camera modules, Millimeter-wave radar modules, ECU, etc. | |
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For secondary mounting reinforcement drop impact resistance liquid encapsulant | ![]() CV5313 CV5314 |
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LSI package and SSD for mobile devices such as notebook PC, digital camera, mobile phones, smartphone and tablet PC. | |
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Thermosetting/UV curing Adhesives | ![]() CV5000 series CV7000 series |
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Image Sensor, etc. |