High elasticity Low CTE IC substrate materials | R-1515W

Low warpage circuit board materials MEGTRON GX R-1515W

 

  1. Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property

Circuit Board Materials

  • Part Number

Laminate R-1515w
Prepreg R-1410w

  • Application
IC substrate
IC substrate
 

Properties

Flexural modulus
25°C 35GPa
CTE x, y-axis
8-10ppm/°C
Tg (DMA)
250°C

Pakage warpage

Pakage warpage

Thermal expansion (x-axis)

Thermal expansion

Heat resistance

Heat resistance

General properties

Item Test method Condition Unit MEGTRON GX
R-1515W
Glass transition temp (Tg) DMA A °C 250
Thermal decomposition temp (Td) TGA A °C 390
T260(with copper)  IPC-TM-650 2.4.24.1 A min >120
T288(with copper)  IPC-TM-650 2.4.24.1 A min >120
CTE x-axis α1 Internal method A ppm/°C 8-10
CTE y-axis 8-10
CTE z-axis α1 IPC-TM-650 2.4.24 A 22
α2 97
Thermal conductivity  Laser Flash 25°C Wm·K 0.7
Dielectric constant(Dk)* 1GHz IPC-TM-650 2.5.5.9 C-24/23/50 4.8
Dissipation factor(Df)* 0.015
Volume resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ·cm 1×109
Surface resistivity 1×108
Flexural modulus* JIS C 6481 25°C GPa 35
250°C 21
Peel strength 1/3oz(12µm) IPC-TM-650 2.4.8 A kN/m 0.9

The sample thickness is 0.1 mm.
* 0.8mm

The above data are typical values and not guaranteed values.

Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)