- Achieve more functionality (multi-pin and integrated circuit) the large-sized PKG by excellent modulus and high heat resistance property
Circuit Board Materials
- Part Number
Laminate R-1515w
Prepreg R-1410w
- Application
IC substrate
Properties
Flexural modulus
25°C 35GPa
25°C 35GPa
CTE x, y-axis
8-10ppm/°C
8-10ppm/°C
Tg (DMA)
250°C
250°C
Pakage warpage
Thermal expansion (x-axis)
Heat resistance
General properties
| Item | Test method | Condition | Unit | MEGTRON GX R-1515W |
|
|---|---|---|---|---|---|
| Glass transition temp (Tg) | DMA | A | °C | 250 | |
| Thermal decomposition temp (Td) | TGA | A | °C | 390 | |
| T260(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | |
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | |
| CTE x-axis | α1 | Internal method | A | ppm/°C | 8-10 |
| CTE y-axis | 8-10 | ||||
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | 22 | |
| α2 | 97 | ||||
| Thermal conductivity | Laser Flash | 25°C | Wm·K | 0.7 | |
| Dielectric constant(Dk)* | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.8 |
| Dissipation factor(Df)* | 0.015 | ||||
| Volume resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ·cm | 1×109 | |
| Surface resistivity | MΩ | 1×108 | |||
| Flexural modulus* | JIS C 6481 | 25°C | GPa | 35 | |
| 250°C | 21 | ||||
| Peel strength | 1/3oz(12µｍ) | IPC-TM-650 2.4.8 | A | kN/m | 0.9 |
The sample thickness is 0.1 mm.
* 0.8mm
The above data are typical values and not guaranteed values.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
