Low CTE Ultra-thin IC substrate materials | R-G515S, R-G515E

Low CTE Ultra-thin IC substrate materials LEXCM GX R-G515

 

  1. With an insulation layer thickness of 15 μm or less, these ultra-thin materials enable thin IC package designs.
  2. The low CTE property can reduce warpage and achieve a good reliability.

Circuit Board Materials

  • Part Number

Low CTE glass cloth

Laminate R-G515S
Prepreg R-G510S

Normal glass cloth

Laminate R-G515E
Prepreg R-G510E

Halogen-free
  • Application
  • Detailed use
Package
・Package
IC substrate
CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)

New branding announcement

  • Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.
    The LEXCM brand now comprises all of the Semiconductor Device Materials; IC packaging materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.
    Additionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX.

Properties

CTE x,y-axis 4-6ppm/°C
(Low CTE glass cloth)
Low warpage
Ultra-thin
Excellent moldability

IC package warpage

IC Pakage Warpage

Melting and Curling Behavior

Melting and Curling Behavior

General properties

Item Test method Condition Unit LEXCM GX
R-G515S
Low CTE glass cloth
LEXCM GX
R-G515E
Normal glass cloth
Glass transition temp.(Tg) DMA* A °C 220-240 220-240
CTE x-axis α1 Internal method A ppm/°C 4-6 6-8
CTE y-axis 4-6 6-8
Young’s modulus ASTM D3039 25°C GPa 23-28 22-27
Peel strength 1/3oz IPC-TM-650 2.4.8 A kN/m 0.7 0.7

The sample thickness is 0.1 mm.
* DMA: Measurement in tensile mode

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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