- The new materials support 800GbE used for next-generation high-speed communication technology.
- Comparison of MEGTRON8 R-5795(U) and MEGTRON7 R-5785(N), improving transmission loss by about 30% (@28GHz) and contributing to improvement in the signal processing performance of high-speed communication networking equipment.
Circuit Board Materials
- Part Number
Ultra-low Df glass cloth type
Laminate R-5795(U)
Prepreg R-5690(U)
Low Dk glass cloth type
Laminate R-5795(N)
Prepreg R-5690(N)
- Application
- Detailed use
・Network
・Wireless
・Wireless
Routers, Switches, Optical Transmission Equipment, Servers, AI Servers, Base Stations, Semiconductor Test Equipment, Probe Cards, etc.
Properties
Dk 3.1 Df 0.0012
@14GHz
@14GHz
Tg(DMA)
220°C
220°C
T288(with copper)
>120min
>120min
Video
Transmission loss performance Ranking in MEGTRON series
Frequency dependence by transmission loss
General properties
| Item | Test method | Condition | Unit | MEGTRON8 R-5795(U) Ultra-low Df glass cloth |
MEGTRON8 R-5795(N) Low Dk glass cloth |
MEGTRON7 R-5785(N) Low Dk glass cloth |
|
|---|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA | A | °C | 220 | 220 | 200 | |
| CTE z-axis | α1 | IPC-TM-650 2.4.24 |
A | ppm/°C | 50 | 50 | 45 |
| α2 | 270 | 270 | 320 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 |
A | min | >120 | >120 | >120 | |
| Dielectric constant(Dk) | 14GHz | Balanced-type circular disk resonator |
C-24/23/50 | － | 3.1 | 3.1 | 3.2 |
| Dissipation factor(Df) | 0.0012 | 0.0016 | 0.0021 | ||||
| Peel strength | 1oz(35μm) | IPC-TM-650 2.4.8 |
A | kN/m | 0.7 [H-VLP3] |
0.7 [H-VLP3] |
0.8 [H-VLP] |
The sample thickness is 0.75mm.
The sample structure is #1078 x 10 ply.
The above data are typical values and not guaranteed values.
