Glass transition temp.(Tg) :DSC
Glass transition temp.(Tg) :TMA
Glass transition temp.(Tg) :DMA
Thermal decomposition temp.(Td):TGA
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Thermal conductivity:Laser flash,25˚C
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Flexural modulus,Warp/MD:JIS C 6481
Flexural modulus,Fill/TD:JIS C 6481
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,C-48/23/50
The sample thickness
The above data are typical values and not guaranteed values.
*1 Test method: TMA