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  • Other Relays / Connectors
  • Fiber Sensors
  • Light Curtains, Safety Components
  • Area Sensors
  • Photoelectric Sensors, Laser Sensors
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  • Pressure Sensors, Flow Sensors
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Glass Composite Circuit Board Materials

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Glass Composite Circuit Board Materials

Photo:Glass Composite Circuit Board Materials
  • Circuit board materials which realize safety performance of the industry-leading and excellent cost performance by size-free manufacturing method.
  • Excellent tracking resistance (CTI600)
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  • Electronic Materials Products

Glass composite circuit board materials

  • High reliability Glass composite circuit board materials R-1785
  • Glass composite circuit board materials R-1786, R-1781
  • Thick copper glass composite circuit board materials R-1786

Related information

[ Related products ]

  • High reliability Glass composite circuit board materials R-1785
  • Glass composite circuit board materials R-1786, R-1781
  • Thick copper glass composite circuit board materials R-1786

[ Common information ]

  • Electronic Materials Top Page
  • Notes before you use

Product News

2018
Jun 4
Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
Mar 9
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
2017
May 12
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
2016
Dec 27
Price Revision for Copper clad Laminates and Mass Laminations
News list
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    • Power Inductors for Automotive application
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    • Multilayer type Power Inductors
    • Voltage Step-up Coils
    • Thermal protection sheet (Graphite Sheet (PGS)/PGS applied products/NASBIS)
    • NTC Thermistor (Chip type)
    • Cooling Fan with Unique Hydro Dynamic Bearing
    • Circuit Board Materials
    • EMC Components
    • Circuit Protection(ESD,Surge,Fuse etc.)
    • Sensors
    • Built-in Sensors
    • Sensors for Factory Automation
    • Switches
    • Force Sensing Capacitive Device
    • Encoders, Potentiometers
    • Microcomputers
    • Audio & Visual
    • NFC Tag
    • LED Driver ICs
    • Motor Driver ICs
    • MOSFETs
    • Laser Diodes
    • Image Sensors
    • Radio Frequency Devices
    • Power Devices
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    • FA Devices
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    • Compressors
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    • Circuit Board Materials
    • Semiconductor Encapsulation Materials, Adhesives
    • Plastic Molding Compound
    • Advanced Films
    • Pana-Tetra Zinc Oxide Single Crystal
    • Pana-Tetra Compound Resin
    • Pana-Tetra Electrification prevention Film
    • "AMTECLEAN A" Cleaning Agent for Injection Molding Machines
    • "AMTECLEAN Z" Inorganic antimicrobial agent
    • Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
    • Conductive Polymer Tantalum Solid Capacitors (POSCAP)
    • Conductive Polymer Aluminum Solid Capacitors (OS-CON)
    • Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
    • Conductive Polymer Aluminum Solid Capacitors (OS-CON)
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    • Film Capacitors (Electronic Equipment Use)
    • Film Capacitors (AC Motor Use)
    • Film Capacitors (Automotive, Industrial and Infrastructure Use)
    • High Precision Chip Resistors
    • Current Sensing Chip Resistors
    • Small & High Power Chip Resistors
    • Anti-Sulfurated Chip Resistors
    • General Purpose Chip Resistors
    • Resistor Network
    • Leaded Resistors
    • Attenuator
    • Power Inductors for Automotive application
    • Power Inductors for Consumer
    • Multilayer type Power Inductors
    • Voltage Step-up Coils
    • Thermal protection sheet (Graphite Sheet (PGS)/PGS applied products/NASBIS)
    • NTC Thermistor (Chip type)
    • Cooling Fan with Unique Hydro Dynamic Bearing
    • Circuit Board Materials for LED lightings/Power Modules "ECOOL" series
    • Common mode Noise Filters
    • Electromagnetic Wave Shield Film
    • ESD Suppressor
    • Chip Varistor
    • Surge Absorbers
    • Fuses
    • MR Sensor
    • Gyro Sensors
    • Temperature Sensors (Automotive use)
    • Position Sensors
    • MA Motion Sensor
    • Infrared Array Sensor Grid-EYE
    • PS-A Pressure Sensors (built-in amplification and temperature compensating circuit)
    • PS Pressure Sensors
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    • Dust (PM) Sensor
    • PIR Motion Sensor PaPIRs
    • Fiber Sensors
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    • Encoders
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    • Rotary Potentiometers
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    • MN103H Series embedded Panasonic core
    • MN103S Series embedded Panasonic core
    • MN103L Series embedded Panasonic core
    • MN101E Series embedded Panasonic core
    • MN101C Series embedded Panasonic core
    • MN101L Series embedded Panasonic core
    • MN1M7 Series embedded ARM core
    • MN1M0 Series embedded ARM core
    • Human Machine Interface Display LSIs
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    • LED Driver ICs for Lighting
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    • Stepping Motor Driver ICs
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    • MOSFETs for Lithium-ion Battery Protection
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    • Interface Terminals
    • Narrow Pitch Connector series for board to FPC
    • Narrow Pitch Connector series for board to board
    • Stacking Connector for High Current
    • FPC & FFC Connector series
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    • MID Solutions (MIPTEC)
    • Fiber Sensors
    • Light Curtains, Safety Components
    • Area Sensors
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    • Timers, Counters, FA Components
    • AC Servo Motors
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    • Options
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    • Reciprocating Compressors (Fixed Speed)
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    • Rotary Compressors (Fixed Speed)
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    • SD Memory Cards
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    • Aspherical Glass Lenses
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    • Ultrasonic Gas Flow Sensor
    • Electronic Component Mounting-related Systems
    • solution items
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    • Final Assembly Test and Packing
    • Display-related Systems
    • measuring-system
    • CO2/MAG Welding Machines
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    • Arc Welding Robots
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    • CO2 Laser Oscillators
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    • Powered Wear
    • Lithium-ion Batteries
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    • Circuit board materials for IC substrate "MEGTRON GX" series
    • Multi-layer circuit board materials for ICT infrastructure equipment "MEGTRON" series
    • Circuit Board Materials for wireless/RF communication equipment
    • Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
    • Circuit Board Materials for LED lightings "ECOOL" series
    • Flexible Circuit Board Materials for Mobile Products "FELIOS" series
    • Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
    • Glass Epoxy Multi-layer Circuit Board Materials
    • Mass laminations(Shield board) "PreMulti"
    • Glass Composite Circuit Board Materials
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    • Semiconductor Packaging Encapsulation Materials for Advanced Package
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    • Liquid Materials for Board level Underfill, Adhesives
    • Plastic Molding Compound for LED "FULL BRIGHT" series
    • High heat resistance Phenolic Molding Compound for Automotive Components
    • High fluidity LCP resin Molding Compound for Mobile Products
    • High heat dissipation Unsaturated Polyester resin Molding Compound for Automotive Components
    • Long-term reliable PBT Molding Compound for Automotive Components
    • Urea molding compounds
    • Melamine molding compounds
    • Optical Films "Fine Tiara" series
    • Sensor films for large-screen touch panel
    • Double-side copper laminate PET films for large-screen touch panel sensor
    • Pana-Tetra Zinc Oxide Single Crystal
    • Pana-Tetra Compound Resin
    • Pana-Tetra Electrification prevention Film
    • "AMTECLEAN A" Cleaning Agent for Injection Molding Machines
    • "AMTECLEAN Z" Inorganic antimicrobial agent
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