Industrial Devices & Solutions
쿠키 정책
Global
Top
Global
상품일람
상품일람
콘덴서(캐패시터)
저항
인덕터(코일)
열대책
EMC대책부품・ 회로보호부품
센서
입력 디바이스・스위치
릴레이・커넥터
FA용 센서 및 디바이스
모터, 컴프레서
커스텀・모듈
FA・용접기
Batteries (for Business)
전자재료
소재
어플리케이션 가이드
어플리케이션 가이드
차량용
공조 시스템
클러스터 HUD
차체 컨트롤 모듈
카 AV 시스템
전기차 충전 시스템
배터리 관리 시스템
밀리파 레이더
차량용 자율주행 서버
파워 윈도 모듈
블랙 박스
타이어 공기압 모니터링 시스템
차량 비상 호출 시스템
전동 바이크
산업용
복합기 프린터 (MFP)
Programmable Logic Controller (PLC)
전동 공구
파워 컨디셔너
3D 프린터
자율배송 로봇
산업용 로봇
드론
어뮤즈먼트 기기
계측 장비
솔루션
AC 서보 모터
무정전 전원 장치 (UPS)
반도체 패키지
공공 인프라
감시 카메라
생체 인식
가스 미터
수도 미터
기지국 스몰셀
디지털 사이니지
서버, 라우터(네트워크 장비)
가전
LED 조명(실링 라이트)
스마트 미터
에어컨
홈 에너지 관리 시스템
냉장고
세탁기
가정용 태양광 발전
가정용 ESS
전자레인지
AV/컴퓨팅
프로젝터
스마트폰
웨어러블 기기
태블릿
VR 헤드셋
헬스케어
휴대용 심전기
혈압계
전동 칫솔
보청기
다운로드
다운로드
Products Catalog
RoHS / REACH Confirmation Report
CAD Data
Circuit Simulation Data
Power Inductors
SP-Cap/Conductive Polymer Aluminum Capacitors
POSCAP/Conductive Polymer Tantalum Solid Capacitors
OS-CON/Conductive Polymer Aluminum Solid Capacitors
Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
Surface Mount Type Aluminum Electrolytic Capacitors
Common mode Noise Filters
Chip Varistors
Varistors (ZNR Surge Absorber)
ESD Suppressor/ ESD Suppressor Array
Battery Product Safety Data Sheet
Lithium battery UN38.3 Test Summary
Certification by public institutions (ISO,IATF)
설계지원
설계지원
Product selection support
Cross reference
Surface Mounted Film Capacitor Application Guide
APPLICATION SEARCH (FA Sensors & Components)
Specification Search (relays, connectors, light touch switches)
Fiber Sensors Search by Specifications
Basic knowledge
Basics of Common Mode Noise Filters
Solutions
Optimal solution for circuit design
Noise / Thermal Solutions
Thermal solutions
Automotive Solutions
FA solutions
Design and simulation
Micro Chip Fuse Selection Tool
Characteristic Viewer
Industrial & Automotive use LC filter simulator
Power Inductor loss simulator for automotive application
Simulator of allowable power by a chip resistor operating temperature
Power module compatible GraphiteTIM Search Tool
Motor capacity selection software for AC Servo Motors: "Mselect"
Motor capacity selection software for Brushless Motors: "Mselect for BL"
Circuit Simulation Data
Conversion of pressure unit
CAD Data
Support
FA Technical Support (for Automation Controls)
Motor Setup Support Software "PANATERM" (for MINAS A6/A5 Family)
Motor Setup Support Software "PANATERM for BL"(for MINAS BL)
뉴스
뉴스
공지 사항
보도자료
Contact us
Contact us
Sales bases
FAQ
Sales bases
FAQ
Capacitors
Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
Conductive Polymer Tantalum Solid Capacitors (POSCAP)
Conductive Polymer Aluminum Solid Capacitors (OS-CON)
Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
Aluminum Electrolytic Capacitors (Surface Mount Type)
Aluminum Electrolytic Capacitors (Radial Lead Type)
Backup Power Supply Modules with Electric Double Layer Capacitors
Electric Double Layer Capacitors (Multilayer Coin Type) (Discontinued products)
Electric Double Layer Capacitors (Wound Type)(Discontinued products)
Film Capacitors (Electronic Equipment Use)
Film Capacitors (AC Motor Use)
Film Capacitors (Automotive, Industrial and Infrastructure Use)
Resistors
High Temperature Chip Resistors
High Precision Chip Resistors
Current Sensing Chip Resistors
Small & High Power Chip Resistors
Anti-Sulfurated Chip Resistors
General Purpose Chip Resistors
Resistor Network
Attenuator
Chip Ring (check terminal)
Leaded Resistors(Discontinued products)
Thermal Sensitive Resistors (Discontinued products)
Trimmer Potentiometers (Discontinued products)
Inductors (Coils)
Power Inductors for Automotive application
Power Inductors for Consumer
Voltage Step-up Coils(Discontinued products)
Multilayer type Power Inductors (Discontinued products)
Choke Coils (Discontinued products)
Chip Inductors (Discontinued products)
Other Inductor (Coil) products
Thermal Management Solutions
Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
NTC Thermistor (Chip type)
Circuit Board Materials for LED lightings "ECOOL" series
Cooling Fan with Unique Hydro Dynamic Bearing
EMC Components, Circuit Protection
Common mode Noise Filters
Electromagnetic Wave Shield Film
EMI Filters (Discontinued products)
ESD Suppressor
Chip Varistor
Varistors (ZNR Surge Absorber)
Fuses
Sensors
MR Sensor
6DoF Inertial Sensor for Automotive (6in1 Sensor)
Gyro Sensors
Temperature Sensors (Automotive use)
Infrared Array Sensor Grid-EYE
PS-A Pressure Sensors (built-in amplification and temperature compensating circuit)
PS Pressure Sensors
PF Pressure Sensors
PM2.5 Sensors
PIR Motion Sensor PaPIRs
MA Motion Sensor(Discontinued products)
1-axis accelerometer GF1(Discontinued products)
Light Sensor NaPiCa (Discontinued products)
GS2 Acceleration Sensor (Discontinued products)
GS1 Acceleration Sensor (Discontinued products)
FA Sensors
Input Devices, Switches
Switches, Encoders, Potentiometers, Touch Solutions
Relays, Connectors
Relays / Couplers, Connectors
FA Sensors & Components
FA Sensors, FA Devices
Motors
Motors for FA & Industrial Application
Motors for Air Conditioning
Motors for Vacuum Cleaner
Motors for Refrigerator
Motors for Automotive
Compressors
DC Pumps
Reciprocating Compressors (Variable Speed)
Rotary Compressors (Fixed Speed)
Rotary Compressors (Variable Speed)
Scroll Compressors (Fixed Speed)
Scroll Compressors (Variable Speed)
Custom & Module Devices
Aspherical Glass Lenses
Ultrasonic Gas Flow and Concentration sensor for Hydrogen GB-L1CMH1A
Molded Lead Frame
Other Custom / Module devices
Factory Automation, Welding Machines
Electronic Component Mounting-related Systems
Solution items
Device-related Systems
Display-related Systems
Measuring system
Final Assembly Test and Packing
Ultra Accuracy 3-D Profilometers
Arc Welding Machines
Industrial Robots
Laser Processing
Welding IoT Solution (VRPS / Bead Eye / iWNB)
Welding Machines others
Other Factory Automation
Batteries (for Business)
Lithium ion Batteries
Nickel-Metal Hydride Batteries
Coin type Rechargeable Lithium Batteries
Primary Lithium Batteries
Dry Batteries
UN38.3 Test Summary (for Lithium batteries)
Electronic Materials
●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Materials
AMTETRA
Antistatic Film
AMTECLEAN A
AMTECLEAN Z
Resin Composite
닫힘
상품일람
어플리케이션 가이드
다운로드
설계지원
뉴스
Contact us
Industrial Devices & Solutions
검색
특성값 검색
Stock Check
Home
상품일람
전자재료
전자회로기판재료
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Models
검색
특성값 검색
Stock Check
상품일람
전자재료
전자회로기판재료
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
Semiconductor Device Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
플라스틱 성형재료
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
기능 필름
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Other New Materials
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models
Notes for using technical information.
Product Overview
Models
Contact Us
Refine your search
Parts no
Product status
New (0)
Active (121)
NRFND (0)
Series/Type
R-F700S (LCP* Single-sided copper clad) (9)
R-F705S (LCP* Double-sided copper clad) (16)
R-F770 (Single-sided copper clad) (36)
R-F775 (Double-sided copper clad) (59)
R-FR10 (FRCC) (1)
재설정
Copper Foil Type
ED (73)
RA (47)
- (1)
재설정
Copper Foil Part No.
BHY (29)
BHY-HA-V2 (5)
BHYA-HS (3)
BHYX-T (10)
F2WS (6)
MT18FL (6)
SEED (6)
T4M-HDR (5)
TP4-S (25)
VLP (25)
- (1)
재설정
Copper Foil Thickness (µm)
-
2 (6)
6 (6)
9 (20)
12 (33)
18 (31)
35 (14)
70 (7)
105 (3)
- (1)
재설정
Fiim Thickness (µm)
-
10 (1)
12.5 (16)
25 (28)
50 (24)
70 (1)
75 (17)
100 (16)
125 (9)
150 (8)
- (1)
재설정
Total products thickness (µm)
-
14.5 (1)
16.5 (1)
18.5 (1)
21.5 (1)
22 (1)
24.5 (3)
27 (1)
29 (1)
30.5 (2)
31 (2)
34 (2)
36.5 (1)
37 (5)
43 (7)
48.5 (2)
49 (3)
54 (1)
56 (1)
60 (1)
61 (3)
62 (4)
68 (6)
73 (1)
74 (3)
79 (1)
82.5 (1)
85 (1)
86 (3)
87 (3)
93 (3)
95 (3)
99 (3)
111 (3)
112 (3)
118 (4)
120 (2)
124 (3)
135 (1)
136 (3)
137 (1)
143 (2)
145 (3)
149 (2)
155 (1)
159 (1)
161 (2)
162 (1)
165 (1)
168 (2)
170 (2)
174 (1)
186 (2)
190 (1)
195 (1)
215 (1)
220 (1)
235 (1)
240 (1)
260 (1)
265 (1)
- (1)
재설정
Glass transition temp.(Tg) :TMA(Ad) (°C)
190 (1)
- (120)
재설정
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)
210 (1)
- (120)
재설정
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
580(Ad) (1)
- (120)
재설정
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 10<sup>8</sup> *2 (1)
- (120)
재설정
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
3 (1)
- (120)
재설정
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
0.019 (1)
- (120)
재설정
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
1.2 *4 (1)
- (120)
재설정
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
0.8(4.6)
(ED:12μm) (1)
- (120)
재설정
Flammability:UL,A+E-168/70
94VTM-0 *5 (1)
- (120)
재설정
The sample thickness
0.032mm
(Cu:12μm, PI:5μm,Ad:15μm) (1)
- (120)
재설정
*1 Condition: C-96/20/65, Unit : MΩ·m
- (121)
재설정
*2 Condition: E-24/50+D-24/23
- (121)
재설정
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
- (121)
재설정
Peel Strength.90°:JIS C 6471.A (mm)
-
0.65 (3)
0.75 (14)
0.8 (8)
0.9 (1)
1 (15)
1.1 (1)
1.2 (2)
1.3 (12)
1.5 (24)
1.6 (9)
1.7 (4)
1.8 (2)
2 (4)
2.2 (1)
2.4 (2)
2.5 (10)
2.6 (2)
3 (4)
- (3)
재설정
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm)
-
0.65 (3)
0.75 (14)
0.8 (8)
0.9 (1)
1 (15)
1.1 (1)
1.2 (2)
1.3 (12)
1.5 (23)
1.6 (10)
1.7 (4)
1.78 (1)
1.8 (1)
2 (4)
2.2 (1)
2.4 (2)
2.5 (10)
2.6 (2)
3 (4)
- (3)
재설정
Dimensional Stability.MD:IPC-TM-650.After Etching (%)
-
-0.055 (1)
-0.048 (1)
-0.0457 (1)
-0.044 (1)
-0.038 (1)
-0.0356 (1)
-0.035 (1)
-0.034 (1)
-0.033 (1)
-0.0277 (1)
-0.0269 (1)
-0.0258 (1)
-0.023 (1)
-0.0218 (1)
-0.02 (2)
-0.0192 (1)
-0.019 (1)
-0.0185 (1)
-0.0183 (1)
-0.018 (2)
-0.0164 (1)
-0.0163 (1)
-0.016 (1)
-0.0154 (1)
-0.0151 (1)
-0.015 (3)
-0.014 (1)
-0.0132 (1)
-0.013 (1)
-0.0127 (1)
-0.012 (2)
-0.011 (2)
-0.0106 (1)
-0.01 (2)
-0.0099 (1)
-0.0088 (1)
-0.008 (1)
-0.0078 (1)
-0.007 (2)
-0.006 (1)
-0.004 (4)
-0.003 (3)
-0.0027 (1)
-0.002 (3)
0 (1)
0.00050 (1)
0.001 (1)
0.002 (1)
0.003 (1)
0.004 (1)
0.0047 (1)
0.005 (1)
0.0059 (1)
0.006 (2)
0.007 (3)
0.008 (2)
0.0086 (1)
0.009 (3)
0.0102 (1)
0.011 (1)
0.015 (2)
0.016 (2)
0.0164 (1)
0.017 (1)
0.0172 (1)
0.019 (2)
0.02 (2)
0.021 (3)
0.0222 (1)
0.023 (1)
0.0233 (1)
0.0235 (1)
0.024 (2)
0.025 (1)
0.0262 (1)
0.0265 (1)
0.0278 (1)
0.0296 (1)
0.03 (1)
0.0301 (1)
0.032 (1)
0.033 (1)
0.036 (1)
0.04 (1)
0.0424 (1)
0.0436 (1)
0.0463 (1)
0.058 (1)
0.064 (2)
- (3)
재설정
Dimensional Stability.TD:IPC-TM-650.After Etching (%)
-
-0.058 (1)
-0.053 (1)
-0.049 (1)
-0.039 (1)
-0.038 (1)
-0.036 (1)
-0.035 (1)
-0.0299 (1)
-0.0278 (1)
-0.027 (1)
-0.0254 (1)
-0.025 (2)
-0.0249 (1)
-0.023 (1)
-0.0222 (1)
-0.021 (1)
-0.0141 (1)
-0.014 (3)
-0.013 (1)
-0.012 (1)
-0.011 (1)
-0.0103 (1)
-0.01 (1)
-0.0085 (1)
-0.008 (2)
-0.007 (1)
-0.0063 (1)
-0.006 (2)
-0.0058 (1)
-0.0057 (1)
-0.005 (3)
-0.0047 (1)
-0.004 (2)
-0.0037 (1)
-0.0023 (1)
-0.0022 (1)
-0.002 (1)
-0.0019 (1)
-0.0015 (1)
-0.001 (1)
-0.00050 (1)
0.001 (3)
0.0012 (1)
0.002 (2)
0.003 (1)
0.004 (2)
0.006 (1)
0.0069 (1)
0.0076 (1)
0.008 (1)
0.009 (3)
0.01 (3)
0.0102 (1)
0.012 (2)
0.0122 (1)
0.013 (1)
0.0156 (1)
0.0167 (1)
0.017 (3)
0.0171 (1)
0.0175 (1)
0.018 (1)
0.02 (4)
0.0209 (1)
0.021 (1)
0.022 (1)
0.0228 (1)
0.023 (1)
0.024 (1)
0.0247 (1)
0.025 (2)
0.0258 (1)
0.027 (2)
0.028 (1)
0.0285 (1)
0.0286 (1)
0.029 (1)
0.0297 (1)
0.032 (1)
0.033 (1)
0.035 (1)
0.0354 (1)
0.038 (1)
0.0383 (1)
0.042 (1)
0.0443 (1)
0.0551 (1)
0.0574 (1)
0.059 (1)
0.0598 (1)
0.0599 (1)
0.06 (1)
0.068 (1)
0.0739 (1)
- (3)
재설정
Dimensional Stability.MD:IPC-TM-650.E-0.5/150 (%)
-
-0.105 (1)
-0.083 (1)
-0.082 (1)
-0.081 (2)
-0.0774 (1)
-0.076 (1)
-0.0688 (1)
-0.067 (1)
-0.0621 (1)
-0.0597 (1)
-0.059 (1)
-0.058 (1)
-0.0579 (1)
-0.056 (1)
-0.055 (1)
-0.0548 (1)
-0.0542 (1)
-0.0523 (1)
-0.0518 (1)
-0.051 (1)
-0.0507 (1)
-0.0497 (1)
-0.049 (1)
-0.047 (1)
-0.045 (1)
-0.0447 (1)
-0.0425 (1)
-0.041 (1)
-0.04 (2)
-0.039 (1)
-0.0381 (1)
-0.038 (1)
-0.0378 (1)
-0.0377 (1)
-0.0376 (1)
-0.037 (1)
-0.036 (3)
-0.0343 (1)
-0.0334 (1)
-0.0333 (1)
-0.033 (1)
-0.032 (1)
-0.031 (1)
-0.0304 (1)
-0.029 (3)
-0.0283 (1)
-0.0281 (1)
-0.026 (1)
-0.0255 (1)
-0.024 (1)
-0.022 (2)
-0.021 (1)
-0.02 (1)
-0.0175 (1)
-0.017 (1)
-0.0162 (1)
-0.016 (1)
-0.013 (1)
-0.0085 (1)
-0.007 (1)
-0.006 (1)
-0.005 (1)
-0.004 (2)
-0.002 (3)
-0.001 (1)
0.0012 (1)
0.005 (1)
0.0052 (1)
0.007 (1)
0.0072 (1)
0.0074 (1)
0.0082 (2)
0.0086 (1)
0.009 (4)
0.0092 (1)
0.0116 (1)
0.0146 (1)
0.0169 (1)
0.019 (1)
0.0242 (1)
0.025 (1)
0.028 (1)
0.034 (1)
0.035 (1)
0.04 (1)
0.045 (1)
0.05 (1)
0.054 (1)
0.06 (1)
0.067 (2)
0.07 (1)
0.0717 (1)
0.072 (1)
0.077 (1)
0.082 (1)
0.0821 (1)
0.088 (1)
0.089 (1)
0.092 (1)
0.0973 (1)
0.0996 (1)
0.108 (1)
0.121 (1)
- (3)
재설정
Dimensional Stability.TD:IPC-TM-650.E-0.5/150 (%)
-
-0.28 (1)
-0.0807 (1)
-0.073 (1)
-0.0684 (1)
-0.066 (1)
-0.064 (1)
-0.062 (2)
-0.058 (1)
-0.057 (1)
-0.0567 (1)
-0.056 (2)
-0.0556 (1)
-0.053 (1)
-0.052 (1)
-0.051 (1)
-0.05 (1)
-0.046 (2)
-0.0459 (1)
-0.044 (1)
-0.0438 (1)
-0.041 (1)
-0.0401 (1)
-0.0394 (1)
-0.039 (1)
-0.0383 (1)
-0.038 (1)
-0.037 (3)
-0.035 (2)
-0.0345 (1)
-0.0337 (1)
-0.0328 (1)
-0.03 (2)
-0.0296 (1)
-0.0293 (1)
-0.029 (2)
-0.028 (1)
-0.027 (1)
-0.026 (1)
-0.0259 (1)
-0.0255 (1)
-0.0251 (1)
-0.0242 (1)
-0.0215 (1)
-0.021 (1)
-0.0193 (1)
-0.019 (1)
-0.017 (1)
-0.0165 (1)
-0.0158 (1)
-0.015 (1)
-0.011 (2)
-0.01 (1)
-0.009 (2)
-0.0084 (1)
-0.008 (2)
-0.007 (1)
-0.003 (1)
-0.002 (1)
-0.001 (1)
0.001 (3)
0.002 (1)
0.0021 (1)
0.0026 (1)
0.003 (1)
0.004 (1)
0.0064 (1)
0.007 (1)
0.0072 (1)
0.008 (1)
0.0088 (1)
0.009 (2)
0.011 (1)
0.013 (2)
0.015 (1)
0.017 (1)
0.021 (1)
0.025 (1)
0.0274 (1)
0.028 (1)
0.0298 (1)
0.031 (1)
0.035 (1)
0.036 (1)
0.0375 (1)
0.04 (1)
0.0413 (1)
0.044 (1)
0.0464 (1)
0.048 (1)
0.053 (1)
0.054 (1)
0.0546 (1)
0.0562 (1)
0.0582 (1)
0.059 (1)
0.0597 (1)
0.064 (1)
0.0713 (1)
0.073 (1)
0.0762 (1)
0.0765 (1)
0.078 (1)
0.094 (1)
- (3)
재설정
Soldering Resistance:JIS C 6471.A (°C)
-
310 (25)
330 (94)
340 (1)
- (1)
재설정
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
-
250 (38)
260 (56)
270 (1)
290 (25)
- (1)
재설정
MIT Test:JIS C 6471.0.38R×4.9N,MD
-
3 (3)
4 (3)
5 (1)
6 (1)
7 (1)
8 (1)
9 (3)
10 (5)
11 (1)
12 (2)
13 (1)
14 (1)
15 (2)
16 (4)
18 (1)
19 (2)
20 (5)
22 (2)
24 (1)
26 (2)
28 (2)
30 (1)
32 (1)
33 (1)
34 (1)
35 (4)
40 (6)
42 (1)
45 (1)
46 (1)
60 (3)
70 (1)
84 (1)
85 (1)
90 (1)
100 (1)
110 (2)
118 (1)
120 (2)
130 (1)
170 (4)
180 (2)
200 (1)
220 (2)
230 (1)
255 (1)
270 (2)
280 (1)
300 (1)
340 (2)
530 (1)
- (28)
재설정
MIT Test:JIS C 6471.0.38R×4.9N,TD
-
3 (3)
4 (3)
6 (1)
7 (2)
8 (3)
9 (1)
10 (5)
12 (4)
13 (1)
15 (6)
16 (2)
18 (3)
20 (4)
25 (1)
26 (3)
28 (2)
30 (1)
31 (1)
33 (1)
35 (2)
39 (1)
40 (9)
50 (1)
54 (1)
60 (4)
61 (1)
70 (1)
83 (1)
94 (1)
100 (2)
110 (1)
120 (2)
130 (1)
160 (2)
170 (3)
190 (1)
200 (1)
220 (2)
230 (1)
250 (1)
260 (1)
280 (1)
290 (2)
340 (2)
550 (1)
- (28)
재설정
Tensile Modulus:IPC-TM-650 (GPa)
-
4.5 (25)
7.1 (95)
- (1)
재설정
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
18 (25)
19.3 (95)
- (1)
재설정
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
17.3 (95)
18 (25)
- (1)
재설정
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
재설정
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
재설정
Dielectric Constant at 10GHz:Cavity resonance.A
3.3 (25)
- (96)
재설정
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
재설정
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
재설정
Dissipation Factor at 10GHz:Cavity resonance.A
0.002 (25)
- (96)
재설정
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14 (120)
- (1)
재설정
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14 (120)
- (1)
재설정
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8 (95)
- (26)
재설정
Water absorption:JIS C 6471.D-24/23 (%)
0.04 (25)
- (96)
재설정
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7 (95)
- (26)
재설정
Tg:DMA.A (°C)
350 (95)
- (26)
재설정
Flammability:UL 94.A+E-168/70
V-0 (79)
VTM-0 (41)
- (1)
재설정
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
- (121)
재설정
Show all filters
검색
Clear all filters
Found
121
matches of 121
Pagination
현재 페이지
1
쪽
2
쪽
3
Next page
next
Last page
last
페이지 당 건수
50
100
Only the selected models
Display list
Download list
Unselect
Reset filters
Select display items
Select display items
Display items
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
Fiim Thickness
Total products thickness
Peel Strength.90°:JIS C 6471.A
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
Dimensional Stability.MD:IPC-TM-650.After Etching
Dimensional Stability.TD:IPC-TM-650.After Etching
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
Soldering Resistance:JIS C 6471.A
Soldering Resistance:JIS C 6471.C-96/40/90
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃, 5℃/min
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃, 5℃/min
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
Insulation resistance:JIS C 6471.C-96/40/90
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
Water absorption:JIS C 6471.D-24/23
Moisture Absorption.IPC-TM-650:C-24/23/50
Tg:DMA.A
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.
Select display items by click or drag-and-drop
Glass transition temp.(Tg) :TMA(Ad)
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad)
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
Choice
Parts no
Catalog /
Datasheet
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
(µm)
Fiim Thickness
(µm)
Total products thickness
(µm)
Peel Strength.90°:JIS C 6471.A
(mm)
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm)
Dimensional Stability.MD:IPC-TM-650.After Etching
(%)
Dimensional Stability.TD:IPC-TM-650.After Etching
(%)
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
(%)
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
(%)
Soldering Resistance:JIS C 6471.A
(°C)
Soldering Resistance:JIS C 6471.C-96/40/90
(°C)
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
(GPa)
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
(Ω)
Insulation resistance:JIS C 6471.C-96/40/90
(Ω)
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%)
Water absorption:JIS C 6471.D-24/23
(%)
Moisture Absorption.IPC-TM-650:C-24/23/50
(%)
Tg:DMA.A
(°C)
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
Glass transition temp.(Tg) :TMA(Ad)
(°C)
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F770_10RB_70-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
25
95
2.5
2.5
-0.0277
0.0247
-0.0597
-0.003
330
260
33
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_11RB_35-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
25
60
1.6
1.6
0.006
-0.007
-0.036
-0.056
330
260
90
130
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12EV_18-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
25
43
1.5
1.5
-0.0078
0.024
-0.0378
0.0021
330
260
180
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12RB_18-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
25
43
1.5
1.5
-0.014
-0.013
-0.055
-0.057
330
260
180
200
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13EV_12-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
25
37
1.5
1.5
0.019
0.008
0.009
0.001
330
260
230
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13RX_12-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
25
37
1.5
1.5
-0.002
0.025
-0.02
-0.011
330
260
270
290
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14EV_9-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
25
34
1.3
1.3
-0.003
0.023
-0.026
0.003
330
260
130
94
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14RN_9-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
25
34
1.3
1.3
-0.0127
-0.0022
-0.0425
-0.0255
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_16ES_6-25-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
25
31
1
1
-0.0258
-0.0103
-0.0579
-0.0345
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_1PEL_2-25-0(ED)
R-F770 (Single-sided copper clad)
ED
MT18FL
2
25
27
1.3
1.3
-0.0356
-0.0037
-0.0497
-0.0215
330
260
120
120
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_21RB_35-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
50
85
2.5
2.5
0.009
0.013
-0.0175
-0.0438
330
260
42
54
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22EV_18-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
50
68
1.7
1.7
0.009
0.02
0.0082
0.013
330
260
35
35
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22RB_18-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
50
68
1.5
1.5
-0.004
-0.01
-0.047
-0.046
330
260
60
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23EV_12-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
50
62
1.6
1.6
0.011
0.009
-0.001
-0.009
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23RX_12-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
50
62
1.5
1.5
-0.002
0.038
-0.031
0.001
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_26ES_6-50-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
50
56
1
1
0.00050
0.0171
-0.0377
-0.0158
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_27RN_105-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
105
50
155
3
3
-0.0154
-0.0278
-0.0621
-0.0807
330
260
24
28
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_30RB_70-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
75
145
2.5
2.5
-0.0185
-0.00050
-0.0688
-0.0459
330
250
19
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_32EV_18-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
75
73
1.5
1.5
-0.008
-0.0058
-0.0304
-0.0328
330
250
15
18
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33EV_12-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
75
87
1.5
1.5
-0.003
-0.0015
-0.0333
-0.0337
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33RX_12-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
75
87
1.5
1.5
0.0102
0.0175
-0.0334
-0.0242
330
250
22
33
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_41EM_35-100-0(ED)
R-F770 (Single-sided copper clad)
ED
T4M-HDR
35
100
135
3
3
-0.0218
-0.0222
-0.056
-0.0556
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42EV_18-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
100
118
2.6
2.6
-0.0088
-0.0085
-0.0381
-0.038
330
250
7
9
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42RB_18-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
100
118
2
2
-0.006
-0.0063
-0.0283
-0.0251
330
250
14
13
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43EV_12-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
100
112
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43RX_12-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
100
112
1.5
1.5
0.0047
0.0076
-0.0281
-0.0259
330
250
13
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_52EF_18-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
18
12.5
30.5
1
1
-0.0183
0.0739
0.0052
0.0546
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_53EF_12-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
12
12.5
24.5
1
1
0.0059
0.0209
-0.0085
0.0026
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_53RX_12-12.5-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
12.5
24.5
1
1
0.0262
0.0551
0.0074
0.0298
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_54EF_9-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
9
12.5
21.5
1
1
0.0296
0.0599
0.0242
0.0597
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_54RN_9-12.5-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
12.5
22
0.9
0.9
-0.0027
0.0258
-0.0162
0.0274
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_56ES_6-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
12.5
18.5
1
1
0.007
0.068
-0.005
0.048
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_5PEL_2-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
MT18FL
2
12.5
14.5
1.3
1.3
0.0086
0.0383
0.0086
0.04
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_A2RB_18-125-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
125
143
2
2
0.02
-0.004
-0.022
-0.029
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B2RB_18-150-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
150
168
2
2
0.015
0.004
-0.016
-0.037
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B4EV_9-150-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
150
159
1.7
1.7
0
-0.0047
-0.0376
-0.0394
330
250
4
4
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_10RB_70-25-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
25
165
2.5
2.5
-0.055
-0.008
-0.105
-0.028
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11EM_35-25-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
25
95
1.8
1.8
-0.007
-0.001
-0.051
-0.051
330
260
110
100
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11RB_35-25-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
25
95
1.6
1.6
-0.019
0.001
-0.045
-0.027
330
260
270
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_12EV_18-25-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
25
61
1.5
1.5
0.008
0.012
0.007
0.009
330
260
170
160
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_12RB_18-25-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
25
61
1.5
1.5
0.0172
0.0297
0.0116
0.0088
340
270
220
230
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_13EV_12-25-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
25
49
1.5
1.5
0.005
0.017
-0.004
0.008
330
260
170
160
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_13RX_12-25-12(RA)
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
25
49
1.5
1.5
-0.004
0.02
-0.032
-0.008
330
260
200
260
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14EV_9-25-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
25
43
1.3
1.3
0.008
0.017
-0.002
0.007
330
260
170
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14RN_9-25-9(RA)
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
9
25
43
1.3
1.3
0.025
0.025
-0.004
-0.011
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14RS_9-25-9(RA)
R-F775 (Double-sided copper clad)
RA
BHYA-HS
9
25
43
1.3
1.3
-0.02
0.032
-0.049
0.0064
330
260
100
110
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_16ES_6-25-6(ED)
R-F775 (Double-sided copper clad)
ED
SEED
6
25
37
1
1
-0.004
0.009
-0.024
0.002
330
260
170
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_17RN_105-25-105(RA
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
105
25
235
1.5
1.5
-0.0164
0.0122
-0.0523
-0.0193
330
260
34
31
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_1PEL_2-25-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
25
29
1.3
1.3
-0.035
0.001
-0.041
-0.007
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_20RB_70-50-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
50
190
1.1
1.1
-0.044
-0.011
-0.082
-0.046
330
260
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-