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Common mode Noise Filters
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Micro Chip Fuse Selection Tool
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Industrial & Automotive use LC filter simulator
Power Inductor loss simulator for automotive application
Simulator of allowable power by a chip resistor operating temperature
Power module compatible GraphiteTIM Search Tool
Motor capacity selection software for AC Servo Motors: "Mselect"
Motor capacity selection software for Brushless Motors: "Mselect for BL"
Circuit Simulation Data
Conversion of pressure unit
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Motor Setup Support Software "PANATERM" (for MINAS A6/A5 Family)
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Capacitors
Conductive Polymer Aluminum Electrolytic Capacitors (SP-Cap)
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Aluminum Electrolytic Capacitors (Surface Mount Type)
Aluminum Electrolytic Capacitors (Radial Lead Type)
Backup Power Supply Modules with Electric Double Layer Capacitors
Electric Double Layer Capacitors (Multilayer Coin Type) (Discontinued products)
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Film Capacitors (Electronic Equipment Use)
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Inductors (Coils)
Power Inductors for Automotive application
Power Inductors for Consumer
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Multilayer type Power Inductors (Discontinued products)
Choke Coils (Discontinued products)
Chip Inductors (Discontinued products)
Other Inductor (Coil) products
Thermal Management Solutions
Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
NTC Thermistor (Chip type)
Circuit Board Materials for LED lightings "ECOOL" series
Cooling Fan with Unique Hydro Dynamic Bearing
EMC Components, Circuit Protection
Common mode Noise Filters
EMI Filters (Discontinued products)
ESD Suppressor
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Varistors (ZNR Surge Absorber)
Fuses
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MR Sensor
6DoF Inertial Sensor for Automotive (6in1 Sensor)
Gyro Sensors
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Infrared Array Sensor Grid-EYE
PS-A Pressure Sensors (built-in amplification and temperature compensating circuit)
PS Pressure Sensors
PF Pressure Sensors
IAQ Sensors
PIR Motion Sensor PaPIRs
MA Motion Sensor(Discontinued products)
1-axis accelerometer GF1(Discontinued products)
Light Sensor NaPiCa (Discontinued products)
GS2 Acceleration Sensor (Discontinued products)
GS1 Acceleration Sensor (Discontinued products)
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Input Devices, Switches
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Aspherical Glass Lenses
Ultrasonic Gas Flow and Concentration sensor for Hydrogen GB-L1CMH1A
Molded Lead Frame
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Factory Automation, Welding Machines
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Final Assembly Test and Packing
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Arc Welding Machines
Industrial Robots
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Welding IoT Solution (VRPS / Bead Eye / iWNB)
Welding Machines others
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Batteries (for Business)
Lithium ion Batteries
Nickel-Metal Hydride Batteries
Coin type Rechargeable Lithium Batteries
Primary Lithium Batteries
Dry Batteries
UN38.3 Test Summary (for Lithium batteries)
Electronic Materials
●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Materials
AMTETRA
Antistatic Film
AMTECLEAN A
AMTECLEAN Z
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상품일람
전자재료
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Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
Semiconductor Device Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
플라스틱 성형재료
Plastic Molding Compound for LED "FULL BRIGHT" series
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
기능 필름
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Other New Materials
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models
Notes for using technical information.
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Parts no
Product status
New (0)
Active (121)
NRFND (0)
Series/Type
R-F700S (LCP* Single-sided copper clad) (9)
R-F705S (LCP* Double-sided copper clad) (16)
R-F770 (Single-sided copper clad) (36)
R-F775 (Double-sided copper clad) (59)
R-FR10 (FRCC) (1)
재설정
Copper Foil Type
ED (73)
RA (47)
- (1)
재설정
Copper Foil Part No.
BHY (29)
BHY-HA-V2 (5)
BHYA-HS (3)
BHYX-T (10)
F2WS (6)
MT18FL (6)
SEED (6)
T4M-HDR (5)
TP4-S (25)
VLP (25)
- (1)
재설정
Copper Foil Thickness (µm)
-
2 (6)
6 (6)
9 (20)
12 (33)
18 (31)
35 (14)
70 (7)
105 (3)
- (1)
재설정
Fiim Thickness (µm)
-
10 (1)
12.5 (16)
25 (28)
50 (24)
70 (1)
75 (17)
100 (16)
125 (9)
150 (8)
- (1)
재설정
Total products thickness (µm)
-
14.5 (1)
16.5 (1)
18.5 (1)
21.5 (1)
22 (1)
24.5 (3)
27 (1)
29 (1)
30.5 (2)
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49 (3)
54 (1)
56 (1)
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61 (3)
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68 (6)
73 (1)
74 (3)
79 (1)
82.5 (1)
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86 (3)
87 (3)
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149 (2)
155 (1)
159 (1)
161 (2)
162 (1)
165 (1)
168 (2)
170 (2)
174 (1)
186 (2)
190 (1)
195 (1)
215 (1)
220 (1)
235 (1)
240 (1)
260 (1)
265 (1)
- (1)
재설정
Glass transition temp.(Tg) :TMA(Ad) (°C)
190 (1)
- (120)
재설정
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)
210 (1)
- (120)
재설정
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
80(Ad) (1)
- (120)
재설정
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
580(Ad) (1)
- (120)
재설정
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 10<sup>8</sup> *2 (1)
- (120)
재설정
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
3 (1)
- (120)
재설정
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
0.019 (1)
- (120)
재설정
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
1.2 *4 (1)
- (120)
재설정
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
0.8(4.6)
(ED:12μm) (1)
- (120)
재설정
Flammability:UL,A+E-168/70
94VTM-0 *5 (1)
- (120)
재설정
The sample thickness
0.032mm
(Cu:12μm, PI:5μm,Ad:15μm) (1)
- (120)
재설정
*1 Condition: C-96/20/65, Unit : MΩ·m
- (121)
재설정
*2 Condition: E-24/50+D-24/23
- (121)
재설정
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
- (121)
재설정
Peel Strength.90°:JIS C 6471.A (mm)
-
0.65 (3)
0.75 (14)
0.8 (8)
0.9 (1)
1 (15)
1.1 (1)
1.2 (2)
1.3 (12)
1.5 (24)
1.6 (9)
1.7 (4)
1.8 (2)
2 (4)
2.2 (1)
2.4 (2)
2.5 (10)
2.6 (2)
3 (4)
- (3)
재설정
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm)
-
0.65 (3)
0.75 (14)
0.8 (8)
0.9 (1)
1 (15)
1.1 (1)
1.2 (2)
1.3 (12)
1.5 (23)
1.6 (10)
1.7 (4)
1.78 (1)
1.8 (1)
2 (4)
2.2 (1)
2.4 (2)
2.5 (10)
2.6 (2)
3 (4)
- (3)
재설정
Dimensional Stability.MD:IPC-TM-650.After Etching (%)
-
-0.055 (1)
-0.048 (1)
-0.0457 (1)
-0.044 (1)
-0.038 (1)
-0.0356 (1)
-0.035 (1)
-0.034 (1)
-0.033 (1)
-0.0277 (1)
-0.0269 (1)
-0.0258 (1)
-0.023 (1)
-0.0218 (1)
-0.02 (2)
-0.0192 (1)
-0.019 (1)
-0.0185 (1)
-0.0183 (1)
-0.018 (2)
-0.0164 (1)
-0.0163 (1)
-0.016 (1)
-0.0154 (1)
-0.0151 (1)
-0.015 (3)
-0.014 (1)
-0.0132 (1)
-0.013 (1)
-0.0127 (1)
-0.012 (2)
-0.011 (2)
-0.0106 (1)
-0.01 (2)
-0.0099 (1)
-0.0088 (1)
-0.008 (1)
-0.0078 (1)
-0.007 (2)
-0.006 (1)
-0.004 (4)
-0.003 (3)
-0.0027 (1)
-0.002 (3)
0 (1)
0.00050 (1)
0.001 (1)
0.002 (1)
0.003 (1)
0.004 (1)
0.0047 (1)
0.005 (1)
0.0059 (1)
0.006 (2)
0.007 (3)
0.008 (2)
0.0086 (1)
0.009 (3)
0.0102 (1)
0.011 (1)
0.015 (2)
0.016 (2)
0.0164 (1)
0.017 (1)
0.0172 (1)
0.019 (2)
0.02 (2)
0.021 (3)
0.0222 (1)
0.023 (1)
0.0233 (1)
0.0235 (1)
0.024 (2)
0.025 (1)
0.0262 (1)
0.0265 (1)
0.0278 (1)
0.0296 (1)
0.03 (1)
0.0301 (1)
0.032 (1)
0.033 (1)
0.036 (1)
0.04 (1)
0.0424 (1)
0.0436 (1)
0.0463 (1)
0.058 (1)
0.064 (2)
- (3)
재설정
Dimensional Stability.TD:IPC-TM-650.After Etching (%)
-
-0.058 (1)
-0.053 (1)
-0.049 (1)
-0.039 (1)
-0.038 (1)
-0.036 (1)
-0.035 (1)
-0.0299 (1)
-0.0278 (1)
-0.027 (1)
-0.0254 (1)
-0.025 (2)
-0.0249 (1)
-0.023 (1)
-0.0222 (1)
-0.021 (1)
-0.0141 (1)
-0.014 (3)
-0.013 (1)
-0.012 (1)
-0.011 (1)
-0.0103 (1)
-0.01 (1)
-0.0085 (1)
-0.008 (2)
-0.007 (1)
-0.0063 (1)
-0.006 (2)
-0.0058 (1)
-0.0057 (1)
-0.005 (3)
-0.0047 (1)
-0.004 (2)
-0.0037 (1)
-0.0023 (1)
-0.0022 (1)
-0.002 (1)
-0.0019 (1)
-0.0015 (1)
-0.001 (1)
-0.00050 (1)
0.001 (3)
0.0012 (1)
0.002 (2)
0.003 (1)
0.004 (2)
0.006 (1)
0.0069 (1)
0.0076 (1)
0.008 (1)
0.009 (3)
0.01 (3)
0.0102 (1)
0.012 (2)
0.0122 (1)
0.013 (1)
0.0156 (1)
0.0167 (1)
0.017 (3)
0.0171 (1)
0.0175 (1)
0.018 (1)
0.02 (4)
0.0209 (1)
0.021 (1)
0.022 (1)
0.0228 (1)
0.023 (1)
0.024 (1)
0.0247 (1)
0.025 (2)
0.0258 (1)
0.027 (2)
0.028 (1)
0.0285 (1)
0.0286 (1)
0.029 (1)
0.0297 (1)
0.032 (1)
0.033 (1)
0.035 (1)
0.0354 (1)
0.038 (1)
0.0383 (1)
0.042 (1)
0.0443 (1)
0.0551 (1)
0.0574 (1)
0.059 (1)
0.0598 (1)
0.0599 (1)
0.06 (1)
0.068 (1)
0.0739 (1)
- (3)
재설정
Dimensional Stability.MD:IPC-TM-650.E-0.5/150 (%)
-
-0.105 (1)
-0.083 (1)
-0.082 (1)
-0.081 (2)
-0.0774 (1)
-0.076 (1)
-0.0688 (1)
-0.067 (1)
-0.0621 (1)
-0.0597 (1)
-0.059 (1)
-0.058 (1)
-0.0579 (1)
-0.056 (1)
-0.055 (1)
-0.0548 (1)
-0.0542 (1)
-0.0523 (1)
-0.0518 (1)
-0.051 (1)
-0.0507 (1)
-0.0497 (1)
-0.049 (1)
-0.047 (1)
-0.045 (1)
-0.0447 (1)
-0.0425 (1)
-0.041 (1)
-0.04 (2)
-0.039 (1)
-0.0381 (1)
-0.038 (1)
-0.0378 (1)
-0.0377 (1)
-0.0376 (1)
-0.037 (1)
-0.036 (3)
-0.0343 (1)
-0.0334 (1)
-0.0333 (1)
-0.033 (1)
-0.032 (1)
-0.031 (1)
-0.0304 (1)
-0.029 (3)
-0.0283 (1)
-0.0281 (1)
-0.026 (1)
-0.0255 (1)
-0.024 (1)
-0.022 (2)
-0.021 (1)
-0.02 (1)
-0.0175 (1)
-0.017 (1)
-0.0162 (1)
-0.016 (1)
-0.013 (1)
-0.0085 (1)
-0.007 (1)
-0.006 (1)
-0.005 (1)
-0.004 (2)
-0.002 (3)
-0.001 (1)
0.0012 (1)
0.005 (1)
0.0052 (1)
0.007 (1)
0.0072 (1)
0.0074 (1)
0.0082 (2)
0.0086 (1)
0.009 (4)
0.0092 (1)
0.0116 (1)
0.0146 (1)
0.0169 (1)
0.019 (1)
0.0242 (1)
0.025 (1)
0.028 (1)
0.034 (1)
0.035 (1)
0.04 (1)
0.045 (1)
0.05 (1)
0.054 (1)
0.06 (1)
0.067 (2)
0.07 (1)
0.0717 (1)
0.072 (1)
0.077 (1)
0.082 (1)
0.0821 (1)
0.088 (1)
0.089 (1)
0.092 (1)
0.0973 (1)
0.0996 (1)
0.108 (1)
0.121 (1)
- (3)
재설정
Dimensional Stability.TD:IPC-TM-650.E-0.5/150 (%)
-
-0.28 (1)
-0.0807 (1)
-0.073 (1)
-0.0684 (1)
-0.066 (1)
-0.064 (1)
-0.062 (2)
-0.058 (1)
-0.057 (1)
-0.0567 (1)
-0.056 (2)
-0.0556 (1)
-0.053 (1)
-0.052 (1)
-0.051 (1)
-0.05 (1)
-0.046 (2)
-0.0459 (1)
-0.044 (1)
-0.0438 (1)
-0.041 (1)
-0.0401 (1)
-0.0394 (1)
-0.039 (1)
-0.0383 (1)
-0.038 (1)
-0.037 (3)
-0.035 (2)
-0.0345 (1)
-0.0337 (1)
-0.0328 (1)
-0.03 (2)
-0.0296 (1)
-0.0293 (1)
-0.029 (2)
-0.028 (1)
-0.027 (1)
-0.026 (1)
-0.0259 (1)
-0.0255 (1)
-0.0251 (1)
-0.0242 (1)
-0.0215 (1)
-0.021 (1)
-0.0193 (1)
-0.019 (1)
-0.017 (1)
-0.0165 (1)
-0.0158 (1)
-0.015 (1)
-0.011 (2)
-0.01 (1)
-0.009 (2)
-0.0084 (1)
-0.008 (2)
-0.007 (1)
-0.003 (1)
-0.002 (1)
-0.001 (1)
0.001 (3)
0.002 (1)
0.0021 (1)
0.0026 (1)
0.003 (1)
0.004 (1)
0.0064 (1)
0.007 (1)
0.0072 (1)
0.008 (1)
0.0088 (1)
0.009 (2)
0.011 (1)
0.013 (2)
0.015 (1)
0.017 (1)
0.021 (1)
0.025 (1)
0.0274 (1)
0.028 (1)
0.0298 (1)
0.031 (1)
0.035 (1)
0.036 (1)
0.0375 (1)
0.04 (1)
0.0413 (1)
0.044 (1)
0.0464 (1)
0.048 (1)
0.053 (1)
0.054 (1)
0.0546 (1)
0.0562 (1)
0.0582 (1)
0.059 (1)
0.0597 (1)
0.064 (1)
0.0713 (1)
0.073 (1)
0.0762 (1)
0.0765 (1)
0.078 (1)
0.094 (1)
- (3)
재설정
Soldering Resistance:JIS C 6471.A (°C)
-
310 (25)
330 (94)
340 (1)
- (1)
재설정
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
-
250 (38)
260 (56)
270 (1)
290 (25)
- (1)
재설정
MIT Test:JIS C 6471.0.38R×4.9N,MD
-
3 (3)
4 (3)
5 (1)
6 (1)
7 (1)
8 (1)
9 (3)
10 (5)
11 (1)
12 (2)
13 (1)
14 (1)
15 (2)
16 (4)
18 (1)
19 (2)
20 (5)
22 (2)
24 (1)
26 (2)
28 (2)
30 (1)
32 (1)
33 (1)
34 (1)
35 (4)
40 (6)
42 (1)
45 (1)
46 (1)
60 (3)
70 (1)
84 (1)
85 (1)
90 (1)
100 (1)
110 (2)
118 (1)
120 (2)
130 (1)
170 (4)
180 (2)
200 (1)
220 (2)
230 (1)
255 (1)
270 (2)
280 (1)
300 (1)
340 (2)
530 (1)
- (28)
재설정
MIT Test:JIS C 6471.0.38R×4.9N,TD
-
3 (3)
4 (3)
6 (1)
7 (2)
8 (3)
9 (1)
10 (5)
12 (4)
13 (1)
15 (6)
16 (2)
18 (3)
20 (4)
25 (1)
26 (3)
28 (2)
30 (1)
31 (1)
33 (1)
35 (2)
39 (1)
40 (9)
50 (1)
54 (1)
60 (4)
61 (1)
70 (1)
83 (1)
94 (1)
100 (2)
110 (1)
120 (2)
130 (1)
160 (2)
170 (3)
190 (1)
200 (1)
220 (2)
230 (1)
250 (1)
260 (1)
280 (1)
290 (2)
340 (2)
550 (1)
- (28)
재설정
Tensile Modulus:IPC-TM-650 (GPa)
-
4.5 (25)
7.1 (95)
- (1)
재설정
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
18 (25)
19.3 (95)
- (1)
재설정
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
17.3 (95)
18 (25)
- (1)
재설정
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
재설정
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
재설정
Dielectric Constant at 10GHz:Cavity resonance.A
3.3 (25)
- (96)
재설정
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
재설정
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
재설정
Dissipation Factor at 10GHz:Cavity resonance.A
0.002 (25)
- (96)
재설정
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14 (120)
- (1)
재설정
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14 (120)
- (1)
재설정
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8 (95)
- (26)
재설정
Water absorption:JIS C 6471.D-24/23 (%)
0.04 (25)
- (96)
재설정
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7 (95)
- (26)
재설정
Tg:DMA.A (°C)
350 (95)
- (26)
재설정
Flammability:UL 94.A+E-168/70
V-0 (79)
VTM-0 (41)
- (1)
재설정
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
- (121)
재설정
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Display items
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
Fiim Thickness
Total products thickness
Peel Strength.90°:JIS C 6471.A
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
Dimensional Stability.MD:IPC-TM-650.After Etching
Dimensional Stability.TD:IPC-TM-650.After Etching
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
Soldering Resistance:JIS C 6471.A
Soldering Resistance:JIS C 6471.C-96/40/90
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃, 5℃/min
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃, 5℃/min
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
Insulation resistance:JIS C 6471.C-96/40/90
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
Water absorption:JIS C 6471.D-24/23
Moisture Absorption.IPC-TM-650:C-24/23/50
Tg:DMA.A
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.
Select display items by click or drag-and-drop
Glass transition temp.(Tg) :TMA(Ad)
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad)
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
Choice
Parts no
Catalog /
Datasheet
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
(µm)
Fiim Thickness
(µm)
Total products thickness
(µm)
Peel Strength.90°:JIS C 6471.A
(mm)
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm)
Dimensional Stability.MD:IPC-TM-650.After Etching
(%)
Dimensional Stability.TD:IPC-TM-650.After Etching
(%)
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
(%)
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
(%)
Soldering Resistance:JIS C 6471.A
(°C)
Soldering Resistance:JIS C 6471.C-96/40/90
(°C)
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
(GPa)
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
(Ω)
Insulation resistance:JIS C 6471.C-96/40/90
(Ω)
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%)
Water absorption:JIS C 6471.D-24/23
(%)
Moisture Absorption.IPC-TM-650:C-24/23/50
(%)
Tg:DMA.A
(°C)
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
Glass transition temp.(Tg) :TMA(Ad)
(°C)
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F770_10RB_70-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
25
95
2.5
2.5
-0.0277
0.0247
-0.0597
-0.003
330
260
33
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_11RB_35-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
25
60
1.6
1.6
0.006
-0.007
-0.036
-0.056
330
260
90
130
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12EV_18-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
25
43
1.5
1.5
-0.0078
0.024
-0.0378
0.0021
330
260
180
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_12RB_18-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
25
43
1.5
1.5
-0.014
-0.013
-0.055
-0.057
330
260
180
200
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13EV_12-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
25
37
1.5
1.5
0.019
0.008
0.009
0.001
330
260
230
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_13RX_12-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
25
37
1.5
1.5
-0.002
0.025
-0.02
-0.011
330
260
270
290
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14EV_9-25-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
25
34
1.3
1.3
-0.003
0.023
-0.026
0.003
330
260
130
94
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_14RN_9-25-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
25
34
1.3
1.3
-0.0127
-0.0022
-0.0425
-0.0255
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_16ES_6-25-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
25
31
1
1
-0.0258
-0.0103
-0.0579
-0.0345
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_1PEL_2-25-0(ED)
R-F770 (Single-sided copper clad)
ED
MT18FL
2
25
27
1.3
1.3
-0.0356
-0.0037
-0.0497
-0.0215
330
260
120
120
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_21RB_35-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
35
50
85
2.5
2.5
0.009
0.013
-0.0175
-0.0438
330
260
42
54
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22EV_18-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
50
68
1.7
1.7
0.009
0.02
0.0082
0.013
330
260
35
35
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_22RB_18-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
50
68
1.5
1.5
-0.004
-0.01
-0.047
-0.046
330
260
60
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23EV_12-50-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
50
62
1.6
1.6
0.011
0.009
-0.001
-0.009
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_23RX_12-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
50
62
1.5
1.5
-0.002
0.038
-0.031
0.001
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_26ES_6-50-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
50
56
1
1
0.00050
0.0171
-0.0377
-0.0158
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_27RN_105-50-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
105
50
155
3
3
-0.0154
-0.0278
-0.0621
-0.0807
330
260
24
28
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_30RB_70-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
70
75
145
2.5
2.5
-0.0185
-0.00050
-0.0688
-0.0459
330
250
19
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_32EV_18-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
75
73
1.5
1.5
-0.008
-0.0058
-0.0304
-0.0328
330
250
15
18
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33EV_12-75-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
75
87
1.5
1.5
-0.003
-0.0015
-0.0333
-0.0337
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_33RX_12-75-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
75
87
1.5
1.5
0.0102
0.0175
-0.0334
-0.0242
330
250
22
33
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_41EM_35-100-0(ED)
R-F770 (Single-sided copper clad)
ED
T4M-HDR
35
100
135
3
3
-0.0218
-0.0222
-0.056
-0.0556
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42EV_18-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
18
100
118
2.6
2.6
-0.0088
-0.0085
-0.0381
-0.038
330
250
7
9
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_42RB_18-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
100
118
2
2
-0.006
-0.0063
-0.0283
-0.0251
330
250
14
13
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43EV_12-100-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
12
100
112
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_43RX_12-100-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
100
112
1.5
1.5
0.0047
0.0076
-0.0281
-0.0259
330
250
13
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_52EF_18-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
18
12.5
30.5
1
1
-0.0183
0.0739
0.0052
0.0546
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_53EF_12-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
12
12.5
24.5
1
1
0.0059
0.0209
-0.0085
0.0026
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_53RX_12-12.5-0(RA)
R-F770 (Single-sided copper clad)
RA
BHYX-T
12
12.5
24.5
1
1
0.0262
0.0551
0.0074
0.0298
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_54EF_9-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
F2WS
9
12.5
21.5
1
1
0.0296
0.0599
0.0242
0.0597
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_54RN_9-12.5-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY-HA-V2
9
12.5
22
0.9
0.9
-0.0027
0.0258
-0.0162
0.0274
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_56ES_6-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
SEED
6
12.5
18.5
1
1
0.007
0.068
-0.005
0.048
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_5PEL_2-12.5-0(ED)
R-F770 (Single-sided copper clad)
ED
MT18FL
2
12.5
14.5
1.3
1.3
0.0086
0.0383
0.0086
0.04
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_A2RB_18-125-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
125
143
2
2
0.02
-0.004
-0.022
-0.029
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B2RB_18-150-0(RA)
R-F770 (Single-sided copper clad)
RA
BHY
18
150
168
2
2
0.015
0.004
-0.016
-0.037
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F770_B4EV_9-150-0(ED)
R-F770 (Single-sided copper clad)
ED
VLP
9
150
159
1.7
1.7
0
-0.0047
-0.0376
-0.0394
330
250
4
4
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_10RB_70-25-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
25
165
2.5
2.5
-0.055
-0.008
-0.105
-0.028
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11EM_35-25-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
25
95
1.8
1.8
-0.007
-0.001
-0.051
-0.051
330
260
110
100
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_11RB_35-25-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
25
95
1.6
1.6
-0.019
0.001
-0.045
-0.027
330
260
270
220
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_12EV_18-25-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
25
61
1.5
1.5
0.008
0.012
0.007
0.009
330
260
170
160
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_12RB_18-25-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
25
61
1.5
1.5
0.0172
0.0297
0.0116
0.0088
340
270
220
230
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_13EV_12-25-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
25
49
1.5
1.5
0.005
0.017
-0.004
0.008
330
260
170
160
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_13RX_12-25-12(RA)
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
25
49
1.5
1.5
-0.004
0.02
-0.032
-0.008
330
260
200
260
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14EV_9-25-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
25
43
1.3
1.3
0.008
0.017
-0.002
0.007
330
260
170
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14RN_9-25-9(RA)
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
9
25
43
1.3
1.3
0.025
0.025
-0.004
-0.011
330
260
340
340
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_14RS_9-25-9(RA)
R-F775 (Double-sided copper clad)
RA
BHYA-HS
9
25
43
1.3
1.3
-0.02
0.032
-0.049
0.0064
330
260
100
110
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_16ES_6-25-6(ED)
R-F775 (Double-sided copper clad)
ED
SEED
6
25
37
1
1
-0.004
0.009
-0.024
0.002
330
260
170
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_17RN_105-25-105(RA
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
105
25
235
1.5
1.5
-0.0164
0.0122
-0.0523
-0.0193
330
260
34
31
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_1PEL_2-25-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
25
29
1.3
1.3
-0.035
0.001
-0.041
-0.007
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
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R-F775_20RB_70-50-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
50
190
1.1
1.1
-0.044
-0.011
-0.082
-0.046
330
260
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
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