Support not only for FOG bonding but for FOF bonding to TCP
Covering a wide range of applications ranging from narrow bezel LCD to flexible AMOLED panels
Realization of switching between methods through installation of panel flip system and unification of FOG/FOF bonding surfaces*
Adoption of new type of handling system ready for resin panels, a warpage correction system and recognition lighting
*The panel flip system to switch between methods
High versatility
Mount universal pre-bonding tool for improving versatility
Easy changeover by adjustment of short pre-bonding tools, unnecessary arrange of pre-bonding tool for each model
High productivity
Realization of high-speed bonding through use of compact design to minimize systems and reduction in stroke
Realization of non-stop supply of parts through use of parts supply units equipped with the alternate function
Line solution
Realization of improved operation analysis/operation through enhancement of the line control function (CIM)
| Model ID | FPX007FG/FF | |||
| Model No. | NM-EFL1TC (Normal Flow : Left to Right) | |||
| Panel Size (mm) | L 25 × W 30 to L 130 × W 190 (equal to 1- to 8-inch) The shorter side : the bonding side Glass panel : panel thickness : 0.3 to 1.1 Total panel thickness : 0.6 to 2.5 Plastic panel : panel thickness : 0.05 to 1.0 Total panel thickness : 0.05 to 2.0 |
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| Cycle Time*1 | FOG bonding : 2.8s/panel (Final bonding time : 5s) FOF bonding : 3.5s/panel (Final bonding time : 5s) |
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| Final Bonding Accuracy*2 | FOG bonding : X : ±10μm/3σ Y : ±12μm/3σ after final bonding FOF bonding : XY : ±15μm/3σ after final bonding |
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| ACF Size (mm) | Width 0.8 to 2.0 Reel diameter : Max.φ230 | |||
| FPC Size (mm) | FOG bonding : L 10 × W 10 × T 0.04 to L 125 × W 150 × T 0.25 FOF bonding : L 10 × W 10 × T 0.04 to L 70 × W 100 × T 0.25 |
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| FPC Tray Size (mm) | L 210 × W 240 × T 6 to L 260 × W 330 × T 10 | |||
| Press Specification | Process | ACF attachment | Pre-bonding | Final bonding |
| Temperature*3 | 40 to 150 ℃ | 40 to 120 ℃ | 40 to 400℃ (Backup stage : 40 to 150℃) |
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| Pressure | 20 to 160 N | 10 to 50 N | 30 to 1000 N | |
| Power Source | 3-phase AC 200 / 220 / 380 / 400 V, 50 / 60 Hz, 8.0 kVA | |||
| Pneumatic Source | 0.45 MPa, 350 L/min (A.N.R.) | |||
| Vacuum Source | -0.08 Mpa × 2 lines, 240 L/min (Total suction flow rate) | |||
| Dimensions (mm) *4 | W 4 895 × D 1 735 × H 1 600*5 (FPC supply unit included) | |||
| Mass*4 | 3 300 kg Temporary placing unit : 520 kg |
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* The value of cycle time or bonding accuracy as an example may vary depending on the conditions such as the process.
*1 : When 1 FPC is bonded per side and 2 panels are simultaneously transported. Varies depending on operating conditions such as process etc.
*2 : Based on our work-piece (Bonding length : 25mm) specially designed for evaluation.
*3 : Tool surface temperature
*4 : Varies depending on the optional configuration
*5 : Excluding the signal tower