Support not only for FOG bonding but for FOF bonding to TCP
• Covering a wide range of applications ranging from narrow bezel LCD to flexible AMOLED panels
• Realization of switching between methods through installation of panel flip system and unification of FOG/FOF bonding surfaces*
• Adoption of new type of handling system ready for resin panels, a warpage correction system and recognition lighting
*The panel flip system to switch between methods
High versatility
• Mount universal pre-bonding tool for improving versatility
• Easy changeover by adjustment of short pre-bonding tools, unnecessary arrange of pre-bonding tool for each model
High productivity
• Realization of high-speed bonding through use of compact design to minimize systems and reduction in stroke
• Realization of non-stop supply of parts through use of parts supply units equipped with the alternate function
Line solution
• Realization of improved operation analysis/operation through enhancement of the line control function (CIM)