Solder Inspection (SPI) • Component Inspection (AOI) - Inspection head
Solder Inspection
- Solder appearance inspection
Mounted component Inspection
- Appearance inspection of mounted components
Pre-mounting foreign object*1 inspection
- Pre-mounting foreign object inspection of BGAs
- Foreign object inspection right before sealed case placement
*1: Intended for chip components (except for 03015 mm chip ).
SPI and AOI automatic switching
- Solder and component inspection is switched automatically according to production data.
Unification of inspection and placement data
- Centrally managed component library or coordinate data does not require two data maintenance of each process.
Automatic link to quality information
- Automatically linked quality information of each process assists your defect cause analysis.
Adhesive Dispensing - Dispensing head
Screw-type discharge mechanism
- Panasonic's NPM has the conventional HDF discharge mechanism, which ensures the high-quality dispensing.
Supports various dot/drawing dispensing patterns
- High accuracy sensor (option) measures local PCB height to calibrate dispensing height, which allows for non-contact dispensing on PCB.
