NPM-D3

High area productivity with total mounting lines
Higher productivity and quality with printing, placement and inspection process integration

Configurable modules allow flexible line setup
Head location flexibility with plug-and-play functions.

Comprehensive control of lines, floor and factory with system software
Production plan support through line operation monitoring.

Total line solution

Model ID NPM-D3 Rear head Front head Lightweight 16-nozzle head 12-nozzle head 8-nozzle head 2-nozzle head Dispensing head No head Lightweight 16-nozzle head NM-EJM6D NM-EJM6D-MD NM-EJM6D 12-nozzle head 8-nozzle head 2-nozzle head Dispensing head NM-EJM6D-MD - NM-EJM6D-D Inspection head NM-EJM6D-MA NM-EJM6D-A No head NM-EJM6D NM-EJM6D-D - PCB dimensions*1 (mm) Dual-lane mode L 50 x W 50 ~ L 510 x W 300 Single-lane mode L 50 x W 50 ~ L 510 x W 590 PCB exchange time Dual-lane mode 0 s* *No 0s when cycle time is 3.6 s or less Single-lane mode 3.6 s* *When selecting short conveyors Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA Pneumatic source *2 0.5 MPa, 100 L /min (A.N.R.) Dimensions *2 (mm) W 832 x D 2 652 *3 x H 1 444 *4 Mass 1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement head Lightweight 16-nozzle head (Per head) 12-nozzle head (Per head) 8-nozzle head (Per head) 2-nozzle head (Per head) High production mode [ON] High production mode [OFF] Max. speed 42 000 cph (0.086 s/ chip) 38 000 cph (0.095 s/ chip) 34 500 cph (0.104 s/ chip) 21 500 cph (0.167 s/ chip) 5 500 cph (0.655 s/ chip) 4 250 cph (0.847 s/ QFP) Placement accuracy (Cpk1) ± 40 µm/chip ±30 μm / chip (±25 μm / chip*5) ±30 μm / chip ± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under ± 30 µm/QFP Component dimensions (mm) 0402 chip*6 to L 6 x W 6 x T 3 03015*6*7/0402 chip*6 to L 6 x W 6 x T 3 0402 chip*6 to L 12 x W 12 x T 6.5 0402 chip*6 to L 32 x W 32 x T 12 0603 chip to L 100 x W 90 x T 28 Component supply Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm Max. 68 (4, 8 mm tape, Small reel) Stick - Max.16 (Single stick feeder) Tray - Max.20 (per tray feeder)

Dispensing head Dot dispensing Draw dispensing Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8 Adhesive position accuracy (Cpk1) ± 75 μ m /dot ± 100 μ m /component Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP SOP,PLCC,QFP, Connector, BGA, CSP

Inspection head 2D inspection head (A) 2D inspection head (B) Resolution 18 µm 9 µm View size (mm) 44.4 x 37.2 21.1 x 17.6 Inspection processing time Solder Inspection *9 0.35s/ View size Component Inspection *9 0.5s/ View size Inspection object Solder Inspection *9 Chip component : 100 μm x 150 μm or more (0603 mm or more) Package component : φ150 μm or more Chip component : 80 μm x 120 μm or more (0402 mm or more) Package component : φ120 μm or more Component Inspection *9 Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 Inspection items Solder Inspection *9 Oozing, blur, misalignment, abnormal shape, bridging Component Inspection *9 Missing, shift, flipping, polarity, foreign object inspection *11 Inspection position accuracy *12 ( Cpk1) ± 20 μm ± 10 μm No. of inspection Solder Inspection *9 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) Component Inspection *9 Max. 10 000 pcs./machine