- Good for hybrid board with MEGTRON series. Standard loss material.
Circuit Board Materials
- Part Number
Laminate R-1755V
Prepreg R-1650V
- Application
- Detailed use
・Network
ICT infrastructure equipment, Measuring instrument, Etc.
Properties
Dk 4.4 Df 0.016
@1GHz
@1GHz
Tg(DSC)
173°C
173°C
T288(with copper)
20min
20min
IST(Interconnect Stress Test)
Solder heat resistance(float)
General properties
| Item | Test method | Condition | Unit | HIPER V R-1755V | |
| Glass transition temp(Tg) | DSC | A | °C | 173 | |
| CTE z-axis | α1 | IPC TM-650 2.4.24 | A | ppm/°C | 44 |
| α2 | 255 | ||||
| T288(with copper) | IPC TM-650 2.4.24.1 | A | min | 20 | |
| Dielectric constant(Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | － | 4.4 |
| Dissipation factor(Df) | 0.016 | ||||
| Peel strength | 1oz(35μm) | IPC TM-650 2.4.8 | A | kN/m | 1.5 |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.
