產品

R-1766(GH)/R-1661(GZ) : Glass Epoxy Circuit Board Materials

Product
Glass Epoxy Circuit Board Materials

Series/Type
Glass Epoxy Multi-layer Circuit Board Materials

Parts no
R-1766(GH)/R-1661(GZ)

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Photo:R-1766(GH)/R-1661(GZ)
Item Performance characteristics
Glass transition temp.(Tg) :DSC (°C) 140
Glass transition temp.(Tg) :TMA (°C) 140
Glass transition temp.(Tg) :DMA (°C) 150
Thermal decomposition temp.(Td):TGA (°C) 315
Thermal decomposition temp.(Td):TG/DTA (°C) -
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min) 5
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min) 1
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 11–13
CTE:α1,X-axis,IPC-TM-650 2.4.41 (ppm/°C) -
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 13–15
CTE:α1,Y-axis,IPC-TM-650 2.4.41 (ppm/°C) -
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 65
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 270
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) 1 x 10⁹
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ) 1 x 10⁸
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 4.6
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 4.3
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.014
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 0.016
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) 0.14
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m) 2
Flammability:UL,C-48/23/50 94V-0
Volume resistivity:C-96/20/65 -
Volume resistivity:C-96/20/65+C-96/40/90 -
Surface resistivity:C-96/20/65 -
Surface resistivity:C-96/20/65+C-96/40/90 -
Insulation resistance:C-96/20/65 -
Insulation resistance:C-96/20/65+D-2/100 -
Dielectric constant (Dk)1MHz:JIS C-96/20/65 -
Dielectric constant (Dk)1MHz:C-96/20/65+D-24/23 -
Dissipation factor (Df)1MHz:C-96/20/65 -
Dissipation factor (Df)1MHz:C-96/20/65+D-24/23 -
Solder heat resistance (260°C) -
Peel strength,Copper foil:0.018mm
(18μm),A		 -
Peel strength,Copper foil:0.018mm
(18μm),S₄		 -
Peel strength,Copper foil:0.035mm
(35μm),A		 -
Peel strength,Copper foil:0.035mm
(35μm),S₄		 -
Heat resistance -
Flexural strength:Fill -
Water absorption:E-24/50+D-24/23 -
Flammability: -
Alkali resistance:dipping (3min) -
The sample thickness 32mil(0.8mm)
The above data are typical values and not guaranteed values. -