Glass epoxy multi-layer circuit board materials | R-1766

多層基板材料 R-1766


  1. Good secondary lamination molding processability, excellent adhesion between the layers
  2. High-speed drilling processing with less resin smear is possible
  3. Excellent electrical and mechanical properties

Circuit Board Materials

  • Part Number

Laminate R-1766
Prepreg R-1661

  • Application
  • Detailed use
・For automotive components, etc
Automotive components, Mobile products, Mobile phone, Amusement equipment, Appliances, Measuring instruments, Etc.


Excellent multilayer lamination
Excellent workability
Dimensional stability

General properties

Item Test method Condition Unit   Multi-layer  
Glass transition temp (Tg) DSC A °C 140
Thermal decomposition (Td) TG/DTA A °C 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13
CTE y-axis 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 65
α2 270
Dielectric constant (Dk) 1GHz IPC TM-650 C-24/23/50 4.3
Dissipation factor (Df) 0.016
Water absorption IPC TM-650 D-24/23 % 0.14
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 2.0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.

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