- MUF materials realize underfilling to the narrow gap under flip-chip without void and overmolding the die at the same mold shot
- Provide a better solution based on high loading technology of fine filler and resin design technology
Semiconductor Encapsulation Materials
- Part Number
CV8581 CV8713
- Application
- Detailed use
・PKG
・Mobile
・Mobile
Advanced IC Packages(Flip-chip package such as FC-CSP, FC-SiP module, etc.)
Press Release
Features
Saving process time
Excellent fillability
for Narrow gap/pitch
for Narrow gap/pitch
Low warpage
EMC (Epoxy Molding Compound) explainer video
Process comparison
Excellent fillability for Narrow gap and pitch
Application
General properties
Item | Unit | LEXCM CF | |||
CV8581MUW | CV8713UB | CV8714AHSL | X8770UY | ||
Tg (TMA) | °C | 170 | 145 | 153 | 150 |
CTE 1 | ppm/°C | 20 | 9 | 12 | 9 |
CTE 2 | 64 | 38 | 47 | 40 | |
Flexural modulus (25°C) | GPa | 16 | 24 | 23 | 26 |
Filler size (Max) | µm | 20 | 20 | 10 | 20 |
Mold shrinkage | % | 0.32 | 0.20 | 0.21 | 0.20 |
The above data are typical values and not guaranteed values.