R-5575/R-5470 : High frequency circuit board materials for wireless/RF applications "XPEDION"series

High frequency circuit board materials for wireless/RF applications "XPEDION"series

High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials XPEDION T1

Parts no

Item Performance characteristics
Glass transition temp.(Tg) :DSC -
Glass transition temp.(Tg) :TMA (°C) 205
Glass transition temp.(Tg) :DMA (°C) 245
Thermal decomposition temp.(Td):TGA (°C) 440
Time to delam(T288)Without Cu:IPC-TM-650 (min) >120
Time to delam(T288)With Cu:IPC-TM-650 (min) >120
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) 13-16
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) 13-16
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 20
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) 155
Thermal conductivity:Laser flash,25˚C (W/m·K) 0.6
Volume resistivity:IPC-TM-650,C-96/35/90 (MΩ·cm) 1 x 10⁹
Surface resistivity:IPC-TM-650,C-96/35/90 (MΩ) 1 x 10⁸
Dielectric constant(Dk)@1GHz:IPC-TM-650,C-24/23/50 3.7
Dielectric constant(Dk)@10GHz:IPC-TM-650,C-24/23/50 -
Dielectric constant(Dk)@10GHz:IPC-TM-650,C-24/23/50
Test method: Cavity resonance
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50 3.7
Dissipation factor(Df )@1GHz:IPC-TM-650,C-24/23/50 0.002
Dissipation factor(Df )@10GHz:IPC-TM-650,C-24/23/50 -
Dissipation factor(Df )@10GHz:IPC-TM-650,C-24/23/50
Test method: Cavity resonance
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50 0.004
Water absorption:IPC-TM-650,D-24/23 (%) 0.23
Flexural modulus,Warp/MD:JIS C 6481 (GPa) -
Flexural modulus,Fill/TD:JIS C 6481 (GPa) -
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) 0.8(4.6)
Flammability:UL,C-48/23/50 94V-0
The sample thickness 0.5mm
The above data are typical values and not guaranteed values. -
*1 Test method: TMA -