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-0.0084 (1)
-0.008 (2)
-0.007 (1)
-0.003 (1)
-0.002 (1)
-0.001 (1)
0.001 (3)
0.002 (1)
0.0021 (1)
0.0026 (1)
0.003 (1)
0.004 (1)
0.0064 (1)
0.007 (1)
0.0072 (1)
0.008 (1)
0.0088 (1)
0.009 (2)
0.011 (1)
0.013 (2)
0.015 (1)
0.017 (1)
0.021 (1)
0.025 (1)
0.0274 (1)
0.028 (1)
0.0298 (1)
0.031 (1)
0.035 (1)
0.036 (1)
0.0375 (1)
0.04 (1)
0.0413 (1)
0.044 (1)
0.0464 (1)
0.048 (1)
0.053 (1)
0.054 (1)
0.0546 (1)
0.0562 (1)
0.0582 (1)
0.059 (1)
0.0597 (1)
0.064 (1)
0.0713 (1)
0.073 (1)
0.0762 (1)
0.0765 (1)
0.078 (1)
0.094 (1)
- (3)
Reset
Soldering Resistance:JIS C 6471.A (°C)
-
310 (25)
330 (94)
340 (1)
- (1)
Reset
Soldering Resistance:JIS C 6471.C-96/40/90 (°C)
-
250 (38)
260 (56)
270 (1)
290 (25)
- (1)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,MD
-
3 (3)
4 (3)
5 (1)
6 (1)
7 (1)
8 (1)
9 (3)
10 (5)
11 (1)
12 (2)
13 (1)
14 (1)
15 (2)
16 (4)
18 (1)
19 (2)
20 (5)
22 (2)
24 (1)
26 (2)
28 (2)
30 (1)
32 (1)
33 (1)
34 (1)
35 (4)
40 (6)
42 (1)
45 (1)
46 (1)
60 (3)
70 (1)
84 (1)
85 (1)
90 (1)
100 (1)
110 (2)
118 (1)
120 (2)
130 (1)
170 (4)
180 (2)
200 (1)
220 (2)
230 (1)
255 (1)
270 (2)
280 (1)
300 (1)
340 (2)
530 (1)
- (28)
Reset
MIT Test:JIS C 6471.0.38R×4.9N,TD
-
3 (3)
4 (3)
6 (1)
7 (2)
8 (3)
9 (1)
10 (5)
12 (4)
13 (1)
15 (6)
16 (2)
18 (3)
20 (4)
25 (1)
26 (3)
28 (2)
30 (1)
31 (1)
33 (1)
35 (2)
39 (1)
40 (9)
50 (1)
54 (1)
60 (4)
61 (1)
70 (1)
83 (1)
94 (1)
100 (2)
110 (1)
120 (2)
130 (1)
160 (2)
170 (3)
190 (1)
200 (1)
220 (2)
230 (1)
250 (1)
260 (1)
280 (1)
290 (2)
340 (2)
550 (1)
- (28)
Reset
Tensile Modulus:IPC-TM-650 (GPa)
-
4.5 (25)
7.1 (95)
- (1)
Reset
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
18 (25)
19.3 (95)
- (1)
Reset
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min (ppm/K)
-
17.3 (95)
18 (25)
- (1)
Reset
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
3.2 (95)
- (26)
Reset
Dielectric Constant at 10GHz:Cavity resonance.A
3.3 (25)
- (96)
Reset
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
0.002 (95)
- (26)
Reset
Dissipation Factor at 10GHz:Cavity resonance.A
0.002 (25)
- (96)
Reset
Insulation resistance:JIS C 6471.A (Ω)
>1.0×10^14 (120)
- (1)
Reset
Insulation resistance:JIS C 6471.C-96/40/90 (Ω)
>1.0×10^14 (120)
- (1)
Reset
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%)
0.8 (95)
- (26)
Reset
Water absorption:JIS C 6471.D-24/23 (%)
0.04 (25)
- (96)
Reset
Moisture Absorption.IPC-TM-650:C-24/23/50 (%)
0.7 (95)
- (26)
Reset
Tg:DMA.A (°C)
350 (95)
- (26)
Reset
Flammability:UL 94.A+E-168/70
V-0 (79)
VTM-0 (41)
- (1)
Reset
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
- (121)
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Display items
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
Fiim Thickness
Total products thickness
Peel Strength.90°:JIS C 6471.A
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
Dimensional Stability.MD:IPC-TM-650.After Etching
Dimensional Stability.TD:IPC-TM-650.After Etching
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
Soldering Resistance:JIS C 6471.A
Soldering Resistance:JIS C 6471.C-96/40/90
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃, 5℃/min
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃, 5℃/min
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
Insulation resistance:JIS C 6471.C-96/40/90
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
Water absorption:JIS C 6471.D-24/23
Moisture Absorption.IPC-TM-650:C-24/23/50
Tg:DMA.A
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance. The test method of above item is determined according to Panasonic internal standard.
Select display items by click or drag-and-drop
Glass transition temp.(Tg) :TMA(Ad)
Glass transition temp.(Tg) :DMA Measurement in tensile mode(Ad)
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
Choice
Parts no
Catalog /
Datasheet
Series/Type
Copper Foil Type
Copper Foil Part No.
Copper Foil Thickness
(µm)
Fiim Thickness
(µm)
Total products thickness
(µm)
Peel Strength.90°:JIS C 6471.A
(mm)
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm)
Dimensional Stability.MD:IPC-TM-650.After Etching
(%)
Dimensional Stability.TD:IPC-TM-650.After Etching
(%)
Dimensional Stability.MD:IPC-TM-650.E-0.5/150
(%)
Dimensional Stability.TD:IPC-TM-650.E-0.5/150
(%)
Soldering Resistance:JIS C 6471.A
(°C)
Soldering Resistance:JIS C 6471.C-96/40/90
(°C)
MIT Test:JIS C 6471.0.38R×4.9N,MD
MIT Test:JIS C 6471.0.38R×4.9N,TD
Tensile Modulus:IPC-TM-650
(GPa)
Coefficient of Thermal Expansion.MD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Coefficient of Thermal Expansion.TD:TMA 100℃→250℃,
5℃/min
(ppm/K)
Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A
Dielectric Constant at 10GHz:Cavity resonance.A
Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A
Dissipation Factor at 10GHz:Cavity resonance.A
Insulation resistance:JIS C 6471.A
(Ω)
Insulation resistance:JIS C 6471.C-96/40/90
(Ω)
Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%)
Water absorption:JIS C 6471.D-24/23
(%)
Moisture Absorption.IPC-TM-650:C-24/23/50
(%)
Tg:DMA.A
(°C)
Flammability:UL 94.A+E-168/70
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.
Glass transition temp.(Tg) :TMA(Ad)
(°C)
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad)
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,A+E-168/70
The sample thickness
*1 Condition: C-96/20/65, Unit : MΩ·m
*2 Condition: E-24/50+D-24/23
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-FR10
R-FR10 (FRCC)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
190
210
80(Ad)
80(Ad)
80(Ad)
580(Ad)
1 x 10<sup>8</sup> *2
3
0.019
1.2 *4
0.8(4.6)
(ED:12μm)
94VTM-0 *5
0.032mm
(Cu:12μm, PI:5μm,Ad:15μm)
-
-
-
R-F775_B4EV_9-150-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
150
168
-
-
-
-
-
-
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_B2RB_18-150-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
150
186
1.6
1.6
-0.023
-0.025
-0.081
-0.062
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_B1RB_35-150-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
150
220
1.6
1.6
-0.048
-0.035
-0.081
-0.066
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A4EV_9-125-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
125
143
-
-
-
-
-
-
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A3EV_12-125-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
125
149
1.5
1.5
-0.0163
-0.0141
-0.04
-0.0401
330
250
5
7
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A2RB_18-125-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
125
161
2
2
-0.015
-0.012
-0.076
-0.044
330
250
9
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A1RB_35-125-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
125
195
1.6
1.6
-0.033
-0.023
-0.059
-0.053
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_A0RB_70-125-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
125
265
2.5
2.5
-0.0192
-0.0299
-0.0548
-0.0684
330
250
9
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_5PEL_2-12.5-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
12.5
16.5
1.3
1.3
0.0164
0.0443
0.0146
0.0413
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_56ES_6-12.5-6(ED)
R-F775 (Double-sided copper clad)
ED
SEED
6
12.5
24.5
1
1
0.017
0.06
0.005
0.053
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_54RS_9-12.5-9(RA)
R-F775 (Double-sided copper clad)
RA
BHYA-HS
9
12.5
31
1
1
0.003
0.033
-0.007
0.025
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_54EF_9-12.5-9(ED)
R-F775 (Double-sided copper clad)
ED
F2WS
9
12.5
30.5
1
1
0.03
0.059
0.025
0.059
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_53RX_12-12.5-12(RA
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
12.5
37
1
1
0.021
0.035
0.009
0.028
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_53EF_12-12.5-12(ED
R-F775 (Double-sided copper clad)
ED
F2WS
12
12.5
36.5
1
1
0.0235
0.0574
0.0092
0.0562
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_52RB_18-12.5-18(RA
R-F775 (Double-sided copper clad)
RA
BHY
18
12.5
48.5
1.2
1.2
0.0436
0.0228
0.0169
-0.0084
330
260
530
550
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_52EF_18-12.5-18(ED
R-F775 (Double-sided copper clad)
ED
F2WS
18
12.5
48.5
1
1
0.016
0.0598
0.0012
0.0464
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_51RB_35-12.5-35(RA
R-F775 (Double-sided copper clad)
RA
BHY
35
12.5
82.5
1.6
1.6
0.006
0.027
-0.013
0.011
330
260
120
120
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
VTM-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_44EV_9-100-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
100
118
1.5
1.5
-0.0099
-0.0023
-0.0255
-0.0165
330
250
9
7
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_43RX_12-100-12(RA)
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
100
124
1.5
1.5
0.015
0.012
-0.006
-0.002
330
250
20
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_43EV_12-100-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
100
124
2.4
2.4
-0.012
-0.014
-0.029
-0.03
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_42RB_18-100-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
100
136
2.2
2.2
0.004
0.003
-0.04
-0.28
330
250
10
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_42EV_18-100-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
100
136
2.6
2.6
-0.011
-0.014
-0.029
-0.037
330
250
10
10
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_41RB_35-100-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
100
170
2.5
2.5
-0.01
-0.005
-0.039
-0.037
330
250
15
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_41EM_35-100-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
10
170
3
3
-0.0151
-0.0249
-0.0447
-0.064
330
250
12
12
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_40RB_70-100-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
100
240
2.5
2.5
-0.0457
-0.0254
-0.0774
-0.0567
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_3PEL_2-75-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
75
79
1.3
1.3
-0.0132
-0.0057
-0.0507
-0.0383
330
250
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_34EV_9-75-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
75
93
1.5
1.5
-0.007
0.0012
-0.0343
-0.0293
330
250
35
39
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_33RX_12-75-12(RA)
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
75
99
1.5
1.5
-0.002
0.01
-0.037
-0.021
330
250
20
30
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_33EV_12-75-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
75
99
1.5
1.5
-0.038
-0.005
-0.083
-0.035
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_32RB_18-75-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
75
111
1.6
1.6
0.001
0.009
-0.017
-0.009
330
250
19
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_32EVY_18-75-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
75
111
1.5
1.5
-0.015
-0.004
0.035
0.031
330
250
16
15
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_31RB_35-75-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
75
145
1.8
1.78
-0.013
0.004
-0.036
-0.015
330
250
20
25
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_31EM_35-75-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
70
145
2.5
2.5
-0.034
-0.025
-0.067
-0.058
330
250
20
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_30RB_70-75-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
75
215
2.5
2.5
-0.0269
-0.0019
-0.0542
-0.0296
330
250
18
20
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_2PEL_2-50-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
50
54
1.3
1.3
-0.02
-0.006
-0.058
-0.05
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_27RN_105-50-105(RA
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
105
50
260
3
3
-0.0106
-0.027
-0.0518
-0.062
330
250
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_26ES_6-50-6(ED)
R-F775 (Double-sided copper clad)
ED
SEED
6
50
62
1
1
0.024
0.027
-0.002
0.009
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_24RS_9-50-9(RA)
R-F775 (Double-sided copper clad)
RA
BHYA-HS
9
50
68
1.2
1.2
-0.01
0.002
-0.036
-0.026
330
260
30
16
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_24EV_9-50-9(ED)
R-F775 (Double-sided copper clad)
ED
VLP
9
50
68
1.7
1.7
-0.015
0.022
-0.033
-0.008
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_23RX_12-50-12(RA)
R-F775 (Double-sided copper clad)
RA
BHYX-T
12
50
74
1.3
1.3
-0.011
-0.008
-0.022
-0.017
330
260
46
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_23EV_12-50-12(ED)
R-F775 (Double-sided copper clad)
ED
VLP
12
50
74
1.7
1.7
0.002
0.01
-0.021
-0.019
330
260
40
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_22RB_18-50-18(RA)
R-F775 (Double-sided copper clad)
RA
BHY
18
50
86
1.5
1.5
0.0233
0.0069
0.0072
0.0072
330
260
60
60
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_22EV_18-50-18(ED)
R-F775 (Double-sided copper clad)
ED
VLP
18
50
86
1.6
1.6
0.009
0.02
0.0082
0.013
330
260
35
35
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_21RB_35-50-35(RA)
R-F775 (Double-sided copper clad)
RA
BHY
35
50
120
1.5
1.6
0.0222
0.0286
0.019
0.001
330
260
35
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_21EM_35-50-35(ED)
R-F775 (Double-sided copper clad)
ED
T4M-HDR
35
50
120
2.5
2.5
-0.018
0.018
-0.038
-0.001
330
260
45
40
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_20RB_70-50-70(RA)
R-F775 (Double-sided copper clad)
RA
BHY
70
50
190
1.1
1.1
-0.044
-0.011
-0.082
-0.046
330
260
26
26
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_1PEL_2-25-2(ED)
R-F775 (Double-sided copper clad)
ED
MT18FL
2
25
29
1.3
1.3
-0.035
0.001
-0.041
-0.007
330
260
-
-
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_17RN_105-25-105(RA
R-F775 (Double-sided copper clad)
RA
BHY-HA-V2
105
25
235
1.5
1.5
-0.0164
0.0122
-0.0523
-0.0193
330
260
34
31
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
R-F775_16ES_6-25-6(ED)
R-F775 (Double-sided copper clad)
ED
SEED
6
25
37
1
1
-0.004
0.009
-0.024
0.002
330
260
170
170
7.1
19.3
17.3
3.2
3.2
-
0.002
0.002
-
>1.0×10^14
>1.0×10^14
0.8
-
0.7
350
V-0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-