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R-F775_30RB_70-75-70(RA) : Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Product
Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Series/Type
R-F775 (Double-sided copper clad)

Parts no
R-F775_30RB_70-75-70(RA)

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Photo:R-F775_30RB_70-75-70(RA)
Item Performance characteristics
Glass transition temp.(Tg) :TMA(Ad) (°C) -
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)		 -
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) -
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) -
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) -
Flammability:UL,A+E-168/70 -
The sample thickness -
*1 Condition: C-96/20/65, Unit : MΩ·m -
*2 Condition: E-24/50+D-24/23 -
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction -
Copper Foil Type RA
Copper Foil Part No. BHY
Copper Foil Thickness (µm) 70
Fiim Thickness (µm) 75
Total products thickness (µm) 215
Peel Strength.90°:JIS C 6471.A (mm) 2.5
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm) 2.5
Dimensional Stability.MD:IPC-TM-650.After Etching (%) -0.0269
Dimensional Stability.TD:IPC-TM-650.After Etching (%) -0.0019
Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%) -0.0542
Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%) -0.0296
Soldering Resistance:JIS C 6471.A (°C) 330
Soldering Resistance:JIS C 6471.C-96/40/90 (°C) 250
MIT Test:JIS C 6471.0.38R×4.9N,MD 18
MIT Test:JIS C 6471.0.38R×4.9N,TD 20
Tensile　Modulus:IPC-TM-650 (GPa) 7.1
Coefficient of Thermal Expansion.MD:TMA　100℃→250℃，
5℃/min (ppm/K)		 19.3
Coefficient of Thermal Expansion.TD:TMA　100℃→250℃，
5℃/min (ppm/K)		 17.3
Dielectric Constant at 1MHz:IPC-TM-650　2.5.5.5.A 3.2
Dielectric Constant at 2GHz:IPC-TM-650　2.5.5.5.A 3.2
Dielectric Constant at 10GHz:Cavity resonance.A -
Dissipation Factor at 1MHz:IPC-TM-650　2.5.5.5.A 0.002
Dissipation Factor at 2GHz:IPC-TM-650　2.5.5.5.A 0.002
Dissipation Factor at 10GHz:Cavity resonance.A -
Insulation resistance:JIS C 6471.A (Ω) ＞1.0×10^14
Insulation resistance:JIS C 6471.C-96/40/90 (Ω) ＞1.0×10^14
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%) 0.8
Water absorption:JIS C 6471.D-24/23 (%) -
Moisture Absorption.IPC-TM-650:C-24/23/50 (%) 0.7
Tg:DMA.A (°C) 350
Flammability:UL 94.A+E-168/70 V-0
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.		 -