Flexible Circuit Board Materials for Mobile Products "FELIOS" series : Models

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Datasheet		 Series/Type Copper Foil Type Copper Foil Part No. Copper Foil Thickness
(µm) 		Fiim Thickness
(µm) 		Total products thickness
(µm) 		Peel Strength.90°:JIS C 6471.A
(mm) 		Peel Strength.90°:JIS C 6471.260℃ Solder 5sec
(mm) 		Dimensional Stability.MD:IPC-TM-650.After Etching
(%) 		Dimensional Stability.TD:IPC-TM-650.After Etching
(%) 		Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150
(%) 		Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150
(%) 		Soldering Resistance:JIS C 6471.A
(°C) 		Soldering Resistance:JIS C 6471.C-96/40/90
(°C) 		MIT Test:JIS C 6471.0.38R×4.9N,MD MIT Test:JIS C 6471.0.38R×4.9N,TD Tensile　Modulus:IPC-TM-650
(GPa) 		Coefficient of Thermal Expansion.MD:TMA　100℃→250℃，
5℃/min
(ppm/K) 		Coefficient of Thermal Expansion.TD:TMA　100℃→250℃，
5℃/min
(ppm/K) 		Dielectric Constant at 1MHz:IPC-TM-650　2.5.5.5.A Dielectric Constant at 2GHz:IPC-TM-650　2.5.5.5.A Dielectric Constant at 10GHz:Cavity resonance.A Dissipation Factor at 1MHz:IPC-TM-650　2.5.5.5.A Dissipation Factor at 2GHz:IPC-TM-650　2.5.5.5.A Dissipation Factor at 10GHz:Cavity resonance.A Insulation resistance:JIS C 6471.A
(Ω)		 Insulation resistance:JIS C 6471.C-96/40/90
(Ω)		 Water absorption.IPC-TM-650:JIS C 6471.D-24/23
(%) 		Water absorption:JIS C 6471.D-24/23
(%) 		Moisture Absorption.IPC-TM-650:C-24/23/50
(%) 		Tg:DMA.A
(°C) 		Flammability:UL 94.A+E-168/70 * These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.		 Glass transition temp.(Tg) :TMA(Ad)
(°C) 		Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad)
(°C) 		CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)		 Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)		 Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)		 Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))		 Flammability:UL,A+E-168/70 The sample thickness *1 Condition: C-96/20/65, Unit : MΩ·m *2 Condition: E-24/50+D-24/23 *3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction
R-F775_43EV_12-100-12(ED)
 R-F775 (Double-sided copper clad) ED VLP 12 100 124 2.4 2.4 -0.012 -0.014 -0.029 -0.03 330 250 10 10 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_43RX_12-100-12(RA)
 R-F775 (Double-sided copper clad) RA BHYX-T 12 100 124 1.5 1.5 0.015 0.012 -0.006 -0.002 330 250 20 20 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_44EV_9-100-9(ED)
 R-F775 (Double-sided copper clad) ED VLP 9 100 118 1.5 1.5 -0.0099 -0.0023 -0.0255 -0.0165 330 250 9 7 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_51RB_35-12.5-35(RA
 R-F775 (Double-sided copper clad) RA BHY 35 12.5 82.5 1.6 1.6 0.006 0.027 -0.013 0.011 330 260 120 120 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_52EF_18-12.5-18(ED
 R-F775 (Double-sided copper clad) ED F2WS 18 12.5 48.5 1 1 0.016 0.0598 0.0012 0.0464 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_52RB_18-12.5-18(RA
 R-F775 (Double-sided copper clad) RA BHY 18 12.5 48.5 1.2 1.2 0.0436 0.0228 0.0169 -0.0084 330 260 530 550 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_53EF_12-12.5-12(ED
 R-F775 (Double-sided copper clad) ED F2WS 12 12.5 36.5 1 1 0.0235 0.0574 0.0092 0.0562 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_53RX_12-12.5-12(RA
 R-F775 (Double-sided copper clad) RA BHYX-T 12 12.5 37 1 1 0.021 0.035 0.009 0.028 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_54EF_9-12.5-9(ED)
 R-F775 (Double-sided copper clad) ED F2WS 9 12.5 30.5 1 1 0.03 0.059 0.025 0.059 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_54RS_9-12.5-9(RA)
 R-F775 (Double-sided copper clad) RA BHYA-HS 9 12.5 31 1 1 0.003 0.033 -0.007 0.025 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_56ES_6-12.5-6(ED)
 R-F775 (Double-sided copper clad) ED SEED 6 12.5 24.5 1 1 0.017 0.06 0.005 0.053 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_5PEL_2-12.5-2(ED)
 R-F775 (Double-sided copper clad) ED MT18FL 2 12.5 16.5 1.3 1.3 0.0164 0.0443 0.0146 0.0413 330 260 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 VTM-0 - - - - - - - - - - - - - - - - -
R-F775_A0RB_70-125-70(RA)
 R-F775 (Double-sided copper clad) RA BHY 70 125 265 2.5 2.5 -0.0192 -0.0299 -0.0548 -0.0684 330 250 9 10 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_A1RB_35-125-35(RA)
 R-F775 (Double-sided copper clad) RA BHY 35 125 195 1.6 1.6 -0.033 -0.023 -0.059 -0.053 330 250 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_A2RB_18-125-18(RA)
 R-F775 (Double-sided copper clad) RA BHY 18 125 161 2 2 -0.015 -0.012 -0.076 -0.044 330 250 9 10 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_A3EV_12-125-12(ED)
 R-F775 (Double-sided copper clad) ED VLP 12 125 149 1.5 1.5 -0.0163 -0.0141 -0.04 -0.0401 330 250 5 7 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_A4EV_9-125-9(ED)
 R-F775 (Double-sided copper clad) ED VLP 9 125 143 - - - - - - 330 250 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_B1RB_35-150-35(RA)
 R-F775 (Double-sided copper clad) RA BHY 35 150 220 1.6 1.6 -0.048 -0.035 -0.081 -0.066 330 250 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_B2RB_18-150-18(RA)
 R-F775 (Double-sided copper clad) RA BHY 18 150 186 1.6 1.6 -0.023 -0.025 -0.081 -0.062 330 250 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-F775_B4EV_9-150-9(ED)
 R-F775 (Double-sided copper clad) ED VLP 9 150 168 - - - - - - 330 250 - - 7.1 19.3 17.3 3.2 3.2 - 0.002 0.002 - ＞1.0×10^14 ＞1.0×10^14 0.8 - 0.7 350 V-0 - - - - - - - - - - - - - - - - -
R-FR10
 R-FR10 (FRCC) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 190 210 80(Ad) 80(Ad) 80(Ad) 580(Ad) 1 x 10<sup>8</sup> *2 3 0.019 1.2 *4 0.8(4.6)
(ED:12μm)		 94VTM-0 *5 0.032mm
(Cu:12μm, PI:5μm,Ad:15μm)		 - - -
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