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R-F705S_22EC_18-50-18(ED) : Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Product
Flexible Circuit Board Materials for Mobile Products "FELIOS" series

Series/Type
R-F705S (LCP* Double-sided copper clad)

Parts no
R-F705S_22EC_18-50-18(ED)

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Photo:R-F705S_22EC_18-50-18(ED)
Item Performance characteristics
Glass transition temp.(Tg) :TMA(Ad) (°C) -
Glass transition temp.(Tg) :DMA
Measurement in tensile mode(Ad) (°C)		 -
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C) -
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm) -
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) -
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50 (Ad) -
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%) -
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch)) -
Flammability:UL,A+E-168/70 -
The sample thickness -
*1 Condition: C-96/20/65, Unit : MΩ·m -
*2 Condition: E-24/50+D-24/23 -
*3 Measured by R-FR10/R-F775 25μm/ R-FR10 construction -
Copper Foil Type ED
Copper Foil Part No. TP4-S
Copper Foil Thickness (µm) 18
Fiim Thickness (µm) 50
Total products thickness (µm) 86
Peel Strength.90°:JIS C 6471.A (mm) 0.8
Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm) 0.8
Dimensional Stability.MD:IPC-TM-650.After Etching (%) 0.016
Dimensional Stability.TD:IPC-TM-650.After Etching (%) -0.038
Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%) 0.05
Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%) -0.035
Soldering Resistance:JIS C 6471.A (°C) 310
Soldering Resistance:JIS C 6471.C-96/40/90 (°C) 290
MIT Test:JIS C 6471.0.38R×4.9N,MD 110
MIT Test:JIS C 6471.0.38R×4.9N,TD 100
Tensile　Modulus:IPC-TM-650 (GPa) 4.5
Coefficient of Thermal Expansion.MD:TMA　100℃→250℃，
5℃/min (ppm/K)		 18
Coefficient of Thermal Expansion.TD:TMA　100℃→250℃，
5℃/min (ppm/K)		 18
Dielectric Constant at 1MHz:IPC-TM-650　2.5.5.5.A -
Dielectric Constant at 2GHz:IPC-TM-650　2.5.5.5.A -
Dielectric Constant at 10GHz:Cavity resonance.A 3.3
Dissipation Factor at 1MHz:IPC-TM-650　2.5.5.5.A -
Dissipation Factor at 2GHz:IPC-TM-650　2.5.5.5.A -
Dissipation Factor at 10GHz:Cavity resonance.A 0.002
Insulation resistance:JIS C 6471.A (Ω) ＞1.0×10^14
Insulation resistance:JIS C 6471.C-96/40/90 (Ω) ＞1.0×10^14
Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%) -
Water absorption:JIS C 6471.D-24/23 (%) 0.04
Moisture Absorption.IPC-TM-650:C-24/23/50 (%) -
Tg:DMA.A (°C) -
Flammability:UL 94.A+E-168/70 VTM-0
* These are observed data, not guaranteed performance.
The test method of above item is determined according to Panasonic internal standard.		 -
[Technical Information]
outgas_datasheet_en(136KB)