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AMTETRA
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AMTECLEAN A
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Product status
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Active (6)
NRFND (0)
Series/Type
Halogen-free Multi-layer circuit board materials (3)
High CTI, High RTI Halogen-free multi-layer circuit board materials (1)
Highly heat resistant Halogen-free Multi-layer circuit board materials (1)
Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials (1)
Reset
Glass transition temp.(Tg) :DSC (°C)
-
148 (3)
175 (2)
- (1)
Reset
Glass transition temp.(Tg) :TMA (°C)
-
145 (2)
160 (1)
170 (2)
- (1)
Reset
Glass transition temp.(Tg) :DMA (°C)
-
170 (3)
200 (1)
- (2)
Reset
Thermal decomposition temp.(Td):TGA (°C)
-
350 (2)
355 (3)
380 (1)
Reset
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1 (min)
>120 (3)
>60 (1)
- (2)
Reset
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1 (min)
10 (2)
3 (1)
>60 (1)
- (2)
Reset
CTE:α1,X-axis,IPC-TM-650 2.4.24 (ppm/°C)
11-13 (4)
- (2)
Reset
CTE:α1,Y-axis,IPC-TM-650 2.4.24 (ppm/°C)
11-15 (3)
13-15 (1)
- (2)
Reset
CTE:α1,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
40 (5)
41 (1)
Reset
CTE:α2,Z-axis,IPC-TM-650 2.4.24 (ppm/°C)
180 (5)
270 (1)
Reset
Thermal conductivity:Laser flash,25˚C (W/m·K)
0.4 (1)
0.62 (2)
- (3)
Reset
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ·cm)
1 x 109 (1)
1 x 10⁹ (3)
- (2)
Reset
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90 (MΩ)
1 x 108 (1)
1 x 10⁸ (3)
- (2)
Reset
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
4.9 (2)
5 (1)
- (3)
Reset
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
3.4 (1)
4.6 (2)
4.7 (1)
- (2)
Reset
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
-
3.2 (1)
4.6 (2)
- (3)
Reset
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
- (6)
Reset
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
0.01 (2)
0.011 (1)
- (3)
Reset
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
-
0.008 (1)
0.01 (2)
0.011 (1)
- (2)
Reset
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
-
0.011 (1)
0.016 (2)
- (3)
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Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
- (6)
Reset
Water absorption:IPC-TM-650 2.6.2.1,D-24/23 (%)
0.07 (1)
0.14 (2)
0.18 (1)
- (2)
Reset
Flexural modulus,Warp/MD:JIS C 6481 (GPa)
24 (2)
26 (1)
- (3)
Reset
Flexural modulus,Fill/TD:JIS C 6481 (GPa)
22 (2)
24 (1)
- (3)
Reset
Peel strength,1oz:IPC-TM-650 2.4.8 (kN/m (lb/inch))
1.6 (2)
1.8 (1)
1.8(10.3) (2)
- (1)
Reset
Flammability:UL,C-48/23/50
94V-0 (1)
94V-0 (4)
- (1)
Reset
The sample thickness
0.8mm (6)
Reset
The above data are typical values and not guaranteed values.
- (6)
Reset
*1 Test method: TMA
- (6)
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Glass transition temp.(Tg) :DSC
Glass transition temp.(Tg) :TMA
Glass transition temp.(Tg) :DMA
Thermal decomposition temp.(Td):TGA
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
CTE:α1,X-axis,IPC-TM-650 2.4.24
CTE:α1,Y-axis,IPC-TM-650 2.4.24
CTE:α1,Z-axis,IPC-TM-650 2.4.24
CTE:α2,Z-axis,IPC-TM-650 2.4.24
Thermal conductivity:Laser flash,25˚C
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
Flexural modulus,Warp/MD:JIS C 6481
Flexural modulus,Fill/TD:JIS C 6481
Peel strength,1oz:IPC-TM-650 2.4.8
Flammability:UL,C-48/23/50
The sample thickness
The above data are typical values and not guaranteed values.
*1 Test method: TMA
Choice
Parts no
Catalog /
Datasheet
Series/Type
Glass transition temp.(Tg) :DSC
(°C)
Glass transition temp.(Tg) :TMA
(°C)
Glass transition temp.(Tg) :DMA
(°C)
Thermal decomposition temp.(Td):TGA
(°C)
Time to delam(T288)Without Cu:IPC-TM-650 2.4.24.1
(min)
Time to delam(T288)With Cu:IPC-TM-650 2.4.24.1
(min)
CTE:α1,X-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Y-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α1,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
CTE:α2,Z-axis,IPC-TM-650 2.4.24
(ppm/°C)
Thermal conductivity:Laser flash,25˚C
(W/m·K)
Volume resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ·cm)
Surface resistivity:IPC-TM-650 2.5.17.1,C-96/35/90
(MΩ)
Dielectric constant(Dk)@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dielectric constant(Dk)@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dielectric constant(Dk)@12GHz:Balanced-type circular disk resonator,C-24/23/50
Dissipation factor(Df )@1MHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@1GHz:IPC-TM-650 2.5.5.9,C-24/23/50
Dissipation factor(Df )@10GHz:IPC-TM-650 2.5.5.5,C-24/23/50
Dissipation factor(Df )@12GHz:Balanced-type circular disk resonator,C-24/23/50
Water absorption:IPC-TM-650 2.6.2.1,D-24/23
(%)
Flexural modulus,Warp/MD:JIS C 6481
(GPa)
Flexural modulus,Fill/TD:JIS C 6481
(GPa)
Peel strength,1oz:IPC-TM-650 2.4.8
(kN/m (lb/inch))
Flammability:UL,C-48/23/50
The sample thickness
The above data are typical values and not guaranteed values.
*1 Test method: TMA
R-1566S/R-1551S
Highly heat resistant Halogen-free Multi-layer circuit board materials
175
170
170
355
>120
10
11-13
13-15
40
180
-
1 x 109
1 x 108
5
4.7
-
-
0.011
0.011
-
-
0.18
-
-
1.6
94V-0
0.8mm
-
-
R-1566(W)/R-1551(W)
Halogen-free Multi-layer circuit board materials
148
145
170
350
>120
3
11-13
11-15
40
180
0.62
1 x 10⁹
1 x 10⁸
4.9
4.6
4.6
-
0.01
0.01
0.016
-
0.14
24
22
1.8(10.3)
94V-0
0.8mm
-
-
R-1566(WN)/R-1551(WN)
Halogen-free Multi-layer circuit board materials
148
145
170
355
>120
10
11-13
11-15
40
180
0.62
1 x 10⁹
1 x 10⁸
4.9
4.6
4.6
-
0.01
0.01
0.016
-
0.14
24
22
1.8(10.3)
94V-0
0.8mm
-
-
R-A555(W)/R-A550(W)
Low Dk Highly heat resistant Halogen-free Multi-layer circuit board materials
-
160
200
380
>60
>60
11-13
11-15
41
270
0.4
1 x 10⁹
1 x 10⁸
-
3.4
3.2
-
-
0.008
0.011
-
0.07
26
24
-
94V-0
0.8mm
-
-
R-1566/R-1551
Halogen-free Multi-layer circuit board materials
148
-
-
350
-
-
-
-
40
180
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.8
-
0.8mm
-
-
R-3566D/R-3551D
High CTI, High RTI Halogen-free multi-layer circuit board materials
175
170
-
355
-
-
-
-
40
180
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.6
94V-0
0.8mm
-
-