High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials | R-5575

High thermal conductive Low transmission loss Halogen-free Multi-layer circuit board materials R-5575

 

  1. For miniaturizing PCBs and stable operation of "5G" small cell with Anti-aging effect, Multi-layer processability, Low transmission loss, High thermal conductivity and Halogen-free.

Circuit Board Materials

  • Part Number

Laminate R-5575
Prepreg R-5470

Halogen-free
 
 
  • Application
  • Detailed use
Network
Wireless
・Network
・Wireless
Power amplifier board(Base station for wireless communication, Small cell), Antenna(Base station), Etc.

Properties

Dk 3.6 Df 0.005
@10GHz
Thermal conductivity
0.60W/m·K
Tg(DMA)
245°C

Frequency dependence by Transmission loss

Frequency dependence by Transmission loss

Long-term stability under High temperature(Dk, Df)

Long-term stability under High temperature(Dk, Df)

General properties

Item Test method Condition Unit Halogen-free
R-5575
Other company
Glass transition temp.(Tg) TMA A °C 205 Tg less
DMA 245 Tg less
Thermal decomposition temp.(Td) TGA A °C 440 414
CTE z-axis α1 IPC-TM-650 2.4.24 A ppm/°C 20 21
α2 155 42
T288(with copper) IPC-TM-650 2.4.24.1 A min >120 >120
Thermal conductivity Laser flash A W/m·K 0.6 0.6
Dielectric constant(Dk) 10GHz Cavity resonance C-24/23/50 3.6 3.5
Dissipation factor(Df) 0.005 0.004
Flexural strength IPC-TM-650 A N/mm2 440 No Data
Peel strength* 1oz(35µm) IPC-TM-650 2.4.8 A kN/m 0.80 0.58
Flammability UL A+E-168/70 94V-0(HF) 94V-0(Br)

The sample thickness is 0.5mm
* RT Copper

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.

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