- For thinner structure replacing coaxial cable with Multi-layer LCP PCB
- For bonding sheet requiring better handling & lamination process
- For FPC cable requiring high speed & low loss
Circuit Board Materials
- Part Number
Bonding sheet R-BM17
Core R-F705S
- Application
- Detailed use
・Mobile
Antenna module for mobile product (Smartphone, tablet PC) etc.
Properties
Thinner replacement
of coaxial cable
of coaxial cable
Better handling
at fabrication
at fabrication
Faster & lower loss
for FPC cable
for FPC cable
Low transmission loss flexible multi-layer circuit board materials 3layers (example)
Transmission loss
Better handling at fabrication
Panasonic Low Dk bonding sheet (R-BM17) |
Other company LCP bonding sheet | |
---|---|---|
Lamination temperature (180-200°C) | 〇 180-200°C |
✕ 310°C |
Keeping temperature (20°C) | 〇 | 〇 |
Electric property (Transmission loss) | 〇 | 〇 |
General properties
Item | Test method | Condition | Unit | R-F705S + R-BM17 | |
---|---|---|---|---|---|
Solder heat resistance | Between LCP and bonding sheet | 60sec. Float limited temperature |
A | °C | 270 Pass |
C96/40/90 | 260 Pass | ||||
Between copper and bonding sheet | A | 270 Pass | |||
C96/40/90 | 260 Pass | ||||
Dielectric constant (Dk)td> | 10GHz | Cavity resonator | A | - | 2.85 |
C96/40/90 | 2.84 | ||||
Dissipation factor (Df) | A | 0.0021 | |||
C96/40/90 | 0.0021 | ||||
Peel strength | Between LCP and bonding sheet | IPC TM-650 | 90° | N/mm | 1.08 |
Between copper and bonding sheet | 0.73 | ||||
MIT folding endurance test | JIS C6471 | R0.38/135°/ 175cpm/500gf |
Number | 55 | |
Weight load flexibility | Circuit outside | Internal method | A | Number | 19 |
Circuit inside | 11 | ||||
Flammability | Combination with LCP | Internal method (Equivalent to UL) |
A | - | 94VTM-0 |
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.