Flexible circuit board materials FELIOS | R-F775

Flexible circuit board materials FELIOS R-F775

 

  1. Felios adhesiveless flex materials are available in a wide-range of film and copper foil thicknesses to support all applications.
  2. Felios offers superior thermal resistance, dimensional stability and quality.
  3. Suitable for aerospace applications with low outgassing. (Compliant with ASTM E-595)

Circuit Board Materials

  • Part Number

Double-sided
copper clad
R-F775
Single-sided
copper clad
R-F770

Halogen-free
  • Application
  • Detailed use
Avionics/SpaceIndustryAutomotive
・Aerospace
・Industry
・Automotive
Consumer mobile products (Smartphone, tablet PC), Medical, Industrial, Avionics/Space applications, In-vehicle cable(Wire harness alternative), etc.

Properties

Superior thermal resistance
MOT 160°C
Wide line-up of film thickness
and copper foil
Excellent dimensional stability

Dimensional stability

Dimensional change after etching

Panasonic Industry FCCL materials

R-F775 After etching

R-F775 After etching

Comparative material

After etching

Comparative material After etching

Evaluation material is R18-100-R18, thickness 4mil.

The above data are typical values and not guaranteed values

Line-up

Line-up

General properties

Item Test method Condition Unit R-F775
Solder heat resistance JIS C6471 A °C >330
C-96/40/90 260
Dielectric constant(Dk) 1GHz ASTM D150 A - 3.2
Dissipation factor(Df) 0.003
Tensile Modulus ASTM D882 A GPa 7.1
Tensile strength Internal method A MPa 542
Peel strength RA: 1/3oz(12μm) JIS C6471 A N/mm 1.35
CTE MD/TD JIS R3251 50-200°C ppm/°C 17 / 19
Z-axis ppm/°C 101
Thermal conductivity Laser flash A W/m・K 0.16
Dimensional stability IPC-TM-650 After etching MD direction % 0.00±0.10
After etching TD direction 0.00±0.10
Water absorption IPC-TM-650 23°C 24h immersion % 0.9
Flammability UL A + E-168/70 94V-0
Outgas TML / CVCM / WVR* ASTM E595-07
ASTM E595-15
% 0.62 / 0.05 / 0.55

The sample thickness is film 25μm, copper foil 12μm.
* TML: Total Mass Loss
 CVCM: Collected Volatile Condensable Material
 WVR: Water Vapor Recovered

Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)

The above data are typical values and not guaranteed values.