Plasma Dicer [Solution]

Why is Plasma Dicer demanded?

Issues of Blade Dicing

Benefits by Plasma Dicing

Blade Dicing


Plasma Dicing


  • Mechanically contacting process
  • Line-by-line process

  • Non-contact by chemical reaction
  • Single process for whole wafer

No damage


More  chips/wafer

φ8inch,Chip size 0.4mm□
Chip/wafer increases in 20%


□1.0mm → ca.1時間
□0.2mm → ca.4.5時間

Reduce dicing time

□1.0mm → 30分
□0.2mm → 30分


Core technologies of Plasma Dicer APX300