Why is Plasma Dicer demanded?
Issues of Blade Dicing
Benefits by Plasma Dicing
Blade Dicing
Plasma Dicing
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ex.)
φ8inch,Chip size 0.4mm□
Chip/wafer increases in 20%
□1.0mm → ca.1時間
□0.2mm → ca.4.5時間
□1.0mm → 30分
□0.2mm → 30分