Multi-layer circuit board materials with excellent high heat resistance and reliability.
In harsh usage environments excellent CAF resistance, through-hole reliability, and laminate processability.
Circuit Board Materials
- Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>
HIPER V | R-1755V - Highly heat resistant Low CTE Multi-layer circuit board materials <High-Tg type>
HIPER D | R-1755D - Highly heat resistant Low CTE Multi-layer circuit board materials <Middle-Tg type>
HIPER M | R-1755M - Highly heat resistant Low CTE Multi-layer circuit board materials
HIPER E | R-1755E
Line-up
General properties
Item | Test method | Condition | Unit | HIPER V R-1755V |
HIPER D R-1755D |
HIPER M R-1755M |
HIPER E R-1755E |
Halogen -free R-1566 |
Conventional FR-4 R-1766 |
|
---|---|---|---|---|---|---|---|---|---|---|
Glass transition temp (Tg) | DSC | A | °C | 173 | 163 | 153 | 133 | 148 | 140 | |
Thermal decomposition temp (Td) | TG/DTA | A | °C | 350 | 345 | 355 | 370 | 350 | 315 | |
CTE x-axis | α1 | IPC TM-650 2.4.41 | A | ppm/°C | 11-13 | 10-12 | 11-13 | 11-13 | 11-13 | 11-13 |
CTE y-axis | 13-15 | 12-14 | 13-15 | 13-15 | 13-15 | 13-15 | ||||
CTE z-axis | α1 | IPC TM-650 2.4.24 | A | 44 | 43 | 40 | 42 | 40 | 65 | |
α2 | 255 | 236 | 240 | 250 | 180 | 270 | ||||
T288 (with copper) | IPC TM-650 2.4.24.1 | A | min | 20 | 15 | 18 | 25 | 3 | 1 | |
Dielectric constant (Dk) | 1GHz | IPC TM-650 2.5.5.9 | C-24/23/50 | – | 4.4 | 4.4 | 4.6 | 4.6 | 4.6 | 4.3 |
Dissipation factor (Df) | 0.016 | 0.016 | 0.014 | 0.013 | 0.010 | 0.016 | ||||
Water absorption | IPC TM-650 2.6.2.1 | D-24/23 | % | 0.12 | 0.11 | 0.11 | 0.11 | 0.14 | 0.14 | |
Flexural modulus | Fill | JIS C6481 | A | GPa | 22 | 21 | 22 | 22 | 22 | 21 |
Peel strength | 1oz | IPC TM-650 2.4.8 | A | kN/m | 1.5 | 1.3 | 1.5 | 1.6 | 1.8 | 2.0 |
The sample thickness is 0.8mm.
The above data are typical values and not guaranteed values.