Product ListIC Substrate Materials "LEXCM GX" seriesSemiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" seriesSemiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" seriesLiquid Materials for Board level Underfill, Adhesives "LEXCM DF" series