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Motor capacity selection software for AC Servo Motors: "Mselect"
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Backup Power Supply Modules with Electric Double Layer Capacitors
Electric Double Layer Capacitors (Multilayer Coin Type) (Discontinued products)
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Film Capacitors (Electronic Equipment Use)
Film Capacitors (AC Motor Use)
Film Capacitors (Automotive, Industrial and Infrastructure Use)
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Power Inductors for Automotive application
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Thermal conductive sheet PGS Graphite Sheet(GraphiteTIM)
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Circuit Board Materials for LED lightings "ECOOL" series
Cooling Fan with Unique Hydro Dynamic Bearing
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PS Pressure Sensors
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MA Motion Sensor(Discontinued products)
1-axis accelerometer GF1(Discontinued products)
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GS2 Acceleration Sensor (Discontinued products)
GS1 Acceleration Sensor (Discontinued products)
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Molded Lead Frame
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Lithium ion Batteries
Nickel-Metal Hydride Batteries
Coin type Rechargeable Lithium Batteries
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Dry Batteries
UN38.3 Test Summary (for Lithium batteries)
Electronic Materials
●Inquiry of Irregularities in Third-party Certification
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound for LED "FULL BRIGHT" series
High heat resistance Phenolic Molding Compound for Automotive Components
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Materials
AMTETRA
Antistatic Film
AMTECLEAN A
AMTECLEAN Z
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產品
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Circuit Board Materials
Multi-layer Circuit Board Materials for ICT infrastructure equipment "MEGTRON" series
High frequency circuit board materials for wireless/RF applications "XPEDION"series
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series
Circuit Board Materials for LED lightings "ECOOL" series
Flexible Circuit Board Materials for Mobile Products "FELIOS" series
Halogen-free Glass Epoxy Multi-layer Circuit Board Materials "Halogen-free" series
Glass Epoxy Circuit Board Materials
Mass laminations(Shield board) "PreMulti"
Glass Composite Circuit Board Materials
Paper Phenolic Circuit Board Materials
Semiconductor Device Materials
IC Substrate Materials "LEXCM GX" series
Semiconductor Packaging Encapsulation Materials for Advanced Package "LEXCM CF", "LEXCM DF" series
Semiconductor Packaging Encapsulation Materials for Automotive/Industrial equipment "LEXCM CF" series
Liquid Materials for Board level Underfill, Adhesives "LEXCM DF" series
Plastic Molding Compound
Plastic Molding Compound for LED "FULL BRIGHT" series
Long-term reliable PBT Molding Compound
Urea molding compounds
Melamine molding compounds
Advanced Films
Functional films for HUD cover
Moldable Low-Reflection Films
Anti-Rainbow and Anti-Blackout Films
Anti-Reflection Films
Other New Materials
Multifunctional Shock Absorber
Thermosetting stretchable film BEYOLEX
Ultra-light EMC shielding material
Multi-layer Circuit Board Materials for Automotive Components "HIPER" series : Documents
Notes for using technical information.
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[Catalog/Datasheet]
Catalog_HIPER_series(163KB)
